电子背散射衍射(EBSD)评价18Cr-9Ni-3Cu-Nb-N钢蠕变损伤——传统霍夫分度与新型球面分度的比较

IF 2.2 3区 工程技术 Q1 MICROSCOPY
Tomotaka Hatakeyama, Kota Sawada
{"title":"电子背散射衍射(EBSD)评价18Cr-9Ni-3Cu-Nb-N钢蠕变损伤——传统霍夫分度与新型球面分度的比较","authors":"Tomotaka Hatakeyama,&nbsp;Kota Sawada","doi":"10.1016/j.micron.2025.103908","DOIUrl":null,"url":null,"abstract":"<div><div>The creep damage evaluation of 18Cr–9Ni–3Cu–Nb–N steel creep interrupted and ruptured at 873 K was performed. Kernel average misorientation (KAM) and grain orientation spread (GOS) values obtained by electron backscattered diffraction (EBSD) through two types of indexing procedures, traditional Hough Indexing (HI) and novel Spherical Indexing (SI), were used as the descriptors of creep damage. The SI resulted in a lower KAM value than that obtained via HI, suggesting improved angular resolution and higher sensitivity for creep damage detection at lower strain levels. The GOS of the virgin sample obtained via SI was also lower than that obtained via HI, whereas that of the crept specimens evaluated via SI and HI were almost identical. Nevertheless, by considering the deviation from the initial value, SI also improved the sensitivity of creep damage detection at the lower strain level using GOS. Therefore, this study revealed the effectiveness of creep damage evaluation with SI compared to that with HI.</div></div>","PeriodicalId":18501,"journal":{"name":"Micron","volume":"199 ","pages":"Article 103908"},"PeriodicalIF":2.2000,"publicationDate":"2025-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Creep damage evaluation of 18Cr–9Ni–3Cu–Nb–N steel by electron backscattered diffraction (EBSD) – comparison of traditional Hough Indexing and novel Spherical Indexing –\",\"authors\":\"Tomotaka Hatakeyama,&nbsp;Kota Sawada\",\"doi\":\"10.1016/j.micron.2025.103908\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The creep damage evaluation of 18Cr–9Ni–3Cu–Nb–N steel creep interrupted and ruptured at 873 K was performed. Kernel average misorientation (KAM) and grain orientation spread (GOS) values obtained by electron backscattered diffraction (EBSD) through two types of indexing procedures, traditional Hough Indexing (HI) and novel Spherical Indexing (SI), were used as the descriptors of creep damage. The SI resulted in a lower KAM value than that obtained via HI, suggesting improved angular resolution and higher sensitivity for creep damage detection at lower strain levels. The GOS of the virgin sample obtained via SI was also lower than that obtained via HI, whereas that of the crept specimens evaluated via SI and HI were almost identical. Nevertheless, by considering the deviation from the initial value, SI also improved the sensitivity of creep damage detection at the lower strain level using GOS. Therefore, this study revealed the effectiveness of creep damage evaluation with SI compared to that with HI.</div></div>\",\"PeriodicalId\":18501,\"journal\":{\"name\":\"Micron\",\"volume\":\"199 \",\"pages\":\"Article 103908\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2025-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Micron\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S096843282500126X\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MICROSCOPY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micron","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S096843282500126X","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MICROSCOPY","Score":null,"Total":0}
引用次数: 0

摘要

对18Cr-9Ni-3Cu-Nb-N钢在873 K温度下的蠕变中断和断裂进行了蠕变损伤评价。利用电子背散射衍射(EBSD)通过传统的霍夫分度(Hough分度)和球面分度(球面分度)两种分度方法得到的核平均取向偏差(KAM)和晶粒取向扩展(GOS)值作为蠕变损伤的描述因子。与HI相比,SI得到的KAM值更低,这表明在较低应变水平下,角分辨率更高,蠕变损伤检测灵敏度更高。通过SI获得的原始样品的GOS也低于通过HI获得的GOS,而通过SI和HI评估的爬行标本的GOS几乎相同。然而,考虑到与初始值的偏差,SI也提高了GOS下应变水平蠕变损伤检测的灵敏度。因此,本研究揭示了与HI相比,SI评价蠕变损伤的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Creep damage evaluation of 18Cr–9Ni–3Cu–Nb–N steel by electron backscattered diffraction (EBSD) – comparison of traditional Hough Indexing and novel Spherical Indexing –
The creep damage evaluation of 18Cr–9Ni–3Cu–Nb–N steel creep interrupted and ruptured at 873 K was performed. Kernel average misorientation (KAM) and grain orientation spread (GOS) values obtained by electron backscattered diffraction (EBSD) through two types of indexing procedures, traditional Hough Indexing (HI) and novel Spherical Indexing (SI), were used as the descriptors of creep damage. The SI resulted in a lower KAM value than that obtained via HI, suggesting improved angular resolution and higher sensitivity for creep damage detection at lower strain levels. The GOS of the virgin sample obtained via SI was also lower than that obtained via HI, whereas that of the crept specimens evaluated via SI and HI were almost identical. Nevertheless, by considering the deviation from the initial value, SI also improved the sensitivity of creep damage detection at the lower strain level using GOS. Therefore, this study revealed the effectiveness of creep damage evaluation with SI compared to that with HI.
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来源期刊
Micron
Micron 工程技术-显微镜技术
CiteScore
4.30
自引率
4.20%
发文量
100
审稿时长
31 days
期刊介绍: Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.
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