Qiao Zhang , Shixiong Kou , Zheng Chen , Jiayu Yang , Nan Deng , Shuhua Liang
{"title":"冻结温度对冰模板法制备MoCu片层复合材料微观结构和性能的影响","authors":"Qiao Zhang , Shixiong Kou , Zheng Chen , Jiayu Yang , Nan Deng , Shuhua Liang","doi":"10.1016/j.ijrmhm.2025.107402","DOIUrl":null,"url":null,"abstract":"<div><div>In this paper, lamellar Mo<img>Cu composites with alternating distribution of Mo phase and Cu phase were prepared by ice-templating and infiltration methods. Briefly, a homogeneous slurry containing Mo powder (2–3 μm), polyvinyl alcohol (PVA), and deionized water was ball-milled, directionally frozen at controlled temperatures (−10 °C to −70 °C), freeze-dried, and then thermally decomposed to form a porous Mo skeleton. Finally, the skeleton was infiltrated with molten Cu at 1350 °C to obtain the dense composite. With the decrease of the freeze temperature, the thickness of the lamellar Mo<img>Cu composite gradually decreases from 34 μm (−10 °C) to 5 μm (−70 °C), the number of interfaces gradually increases, and the hardness of the lamellar Mo<img>Cu composite surface perpendicular to the lamellar direction becomes higher and higher (the maximum hardness value can reach 160.4 HV<sub>0.3,</sub> a 33.3 % enhancement compared to conventional homogeneous Mo<img>Cu composites). The thermal conductivity parallel to lamellae decreases from 260.7 W/m·K (−10 °C) to 249.3 W/m·K (−70 °C), while the thermal expansion coefficient parallel to lamellae reduces from 1.12 × 10<sup>−5</sup>/K (−10 °C) to 9.36 × 10<sup>−6</sup>/K (−70 °C). The thermal conductivity parallel to the lamellar direction is higher than that perpendicular to the lamellar direction, and the average thermal expansion coefficient is lower than that perpendicular to the lamellar direction. The thermal conductivity and thermal expansion coefficient of the lamellar Mo<img>Cu composite parallel to the lamellar direction achieve a good match, demonstrating its potential for advanced thermal management applications.</div></div>","PeriodicalId":14216,"journal":{"name":"International Journal of Refractory Metals & Hard Materials","volume":"133 ","pages":"Article 107402"},"PeriodicalIF":4.6000,"publicationDate":"2025-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of freezing temperature on microstructure and properties of lamellar MoCu composites fabricated by ice-templating method\",\"authors\":\"Qiao Zhang , Shixiong Kou , Zheng Chen , Jiayu Yang , Nan Deng , Shuhua Liang\",\"doi\":\"10.1016/j.ijrmhm.2025.107402\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In this paper, lamellar Mo<img>Cu composites with alternating distribution of Mo phase and Cu phase were prepared by ice-templating and infiltration methods. Briefly, a homogeneous slurry containing Mo powder (2–3 μm), polyvinyl alcohol (PVA), and deionized water was ball-milled, directionally frozen at controlled temperatures (−10 °C to −70 °C), freeze-dried, and then thermally decomposed to form a porous Mo skeleton. Finally, the skeleton was infiltrated with molten Cu at 1350 °C to obtain the dense composite. With the decrease of the freeze temperature, the thickness of the lamellar Mo<img>Cu composite gradually decreases from 34 μm (−10 °C) to 5 μm (−70 °C), the number of interfaces gradually increases, and the hardness of the lamellar Mo<img>Cu composite surface perpendicular to the lamellar direction becomes higher and higher (the maximum hardness value can reach 160.4 HV<sub>0.3,</sub> a 33.3 % enhancement compared to conventional homogeneous Mo<img>Cu composites). The thermal conductivity parallel to lamellae decreases from 260.7 W/m·K (−10 °C) to 249.3 W/m·K (−70 °C), while the thermal expansion coefficient parallel to lamellae reduces from 1.12 × 10<sup>−5</sup>/K (−10 °C) to 9.36 × 10<sup>−6</sup>/K (−70 °C). The thermal conductivity parallel to the lamellar direction is higher than that perpendicular to the lamellar direction, and the average thermal expansion coefficient is lower than that perpendicular to the lamellar direction. The thermal conductivity and thermal expansion coefficient of the lamellar Mo<img>Cu composite parallel to the lamellar direction achieve a good match, demonstrating its potential for advanced thermal management applications.</div></div>\",\"PeriodicalId\":14216,\"journal\":{\"name\":\"International Journal of Refractory Metals & Hard Materials\",\"volume\":\"133 \",\"pages\":\"Article 107402\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-08-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Refractory Metals & Hard Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0263436825003671\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Refractory Metals & Hard Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0263436825003671","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Influence of freezing temperature on microstructure and properties of lamellar MoCu composites fabricated by ice-templating method
In this paper, lamellar MoCu composites with alternating distribution of Mo phase and Cu phase were prepared by ice-templating and infiltration methods. Briefly, a homogeneous slurry containing Mo powder (2–3 μm), polyvinyl alcohol (PVA), and deionized water was ball-milled, directionally frozen at controlled temperatures (−10 °C to −70 °C), freeze-dried, and then thermally decomposed to form a porous Mo skeleton. Finally, the skeleton was infiltrated with molten Cu at 1350 °C to obtain the dense composite. With the decrease of the freeze temperature, the thickness of the lamellar MoCu composite gradually decreases from 34 μm (−10 °C) to 5 μm (−70 °C), the number of interfaces gradually increases, and the hardness of the lamellar MoCu composite surface perpendicular to the lamellar direction becomes higher and higher (the maximum hardness value can reach 160.4 HV0.3, a 33.3 % enhancement compared to conventional homogeneous MoCu composites). The thermal conductivity parallel to lamellae decreases from 260.7 W/m·K (−10 °C) to 249.3 W/m·K (−70 °C), while the thermal expansion coefficient parallel to lamellae reduces from 1.12 × 10−5/K (−10 °C) to 9.36 × 10−6/K (−70 °C). The thermal conductivity parallel to the lamellar direction is higher than that perpendicular to the lamellar direction, and the average thermal expansion coefficient is lower than that perpendicular to the lamellar direction. The thermal conductivity and thermal expansion coefficient of the lamellar MoCu composite parallel to the lamellar direction achieve a good match, demonstrating its potential for advanced thermal management applications.
期刊介绍:
The International Journal of Refractory Metals and Hard Materials (IJRMHM) publishes original research articles concerned with all aspects of refractory metals and hard materials. Refractory metals are defined as metals with melting points higher than 1800 °C. These are tungsten, molybdenum, chromium, tantalum, niobium, hafnium, and rhenium, as well as many compounds and alloys based thereupon. Hard materials that are included in the scope of this journal are defined as materials with hardness values higher than 1000 kg/mm2, primarily intended for applications as manufacturing tools or wear resistant components in mechanical systems. Thus they encompass carbides, nitrides and borides of metals, and related compounds. A special focus of this journal is put on the family of hardmetals, which is also known as cemented tungsten carbide, and cermets which are based on titanium carbide and carbonitrides with or without a metal binder. Ceramics and superhard materials including diamond and cubic boron nitride may also be accepted provided the subject material is presented as hard materials as defined above.