可承受载荷声子晶体的拓扑优化

IF 2.9 3区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
Wei-Zhi Luo, Chao Wang, Mu He, Liang Xia
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引用次数: 0

摘要

声子晶体是人工设计的超材料,在隔振方面表现出优异的性能。虽然它们的隔振应用优化已经得到了广泛的研究,但承载功能的集成还需要进一步的研究。我们的工作提出了一种承载声子晶体的拓扑优化框架,该框架在模量约束下最大化带隙。采用双尺度渐近均匀化理论计算静态或动态状态下的有效模量。此外,采用具有独立惩罚因子的材料插值模型分析了其对优化构型的影响。数值结果证实了所提优化框架的有效性,并揭示了承载约束对隔振性能的显著影响。这一工作丰富了多功能声子晶体的理论基础和方法框架,该晶体兼顾了承载和隔振性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Topology Optimization of Load-Bearable Phononic Crystals

Phononic crystals are artificially engineered metamaterials that exhibit outstanding performance in vibro-isolation. While their optimization for vibro-isolation applications has been widely studied, the integration of load-bearing functionality requires further research. Our work presents a topology optimization framework for load-bearing phononic crystals that maximizes band-gaps under modulus constraints. Two-scale asymptotic homogenization theory is considered to calculate the effective modulus under a static or dynamic regime. Additionally, a material interpolation model with independent penalty factors is employed to analyze its influence on the optimized configuration. Numerical results confirm the effectiveness of the proposed optimization framework and reveal the significant impact of load-bearing constraints on vibro-isolation performance. This work enriches the theoretical foundation and methodological framework for multifunctional phononic crystals that combine load-bearing and vibro-isolation performance.

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来源期刊
CiteScore
5.70
自引率
6.90%
发文量
276
审稿时长
5.3 months
期刊介绍: The International Journal for Numerical Methods in Engineering publishes original papers describing significant, novel developments in numerical methods that are applicable to engineering problems. The Journal is known for welcoming contributions in a wide range of areas in computational engineering, including computational issues in model reduction, uncertainty quantification, verification and validation, inverse analysis and stochastic methods, optimisation, element technology, solution techniques and parallel computing, damage and fracture, mechanics at micro and nano-scales, low-speed fluid dynamics, fluid-structure interaction, electromagnetics, coupled diffusion phenomena, and error estimation and mesh generation. It is emphasized that this is by no means an exhaustive list, and particularly papers on multi-scale, multi-physics or multi-disciplinary problems, and on new, emerging topics are welcome.
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