Transient responses of an eccentric Mode-III crack in a piezoelectric semiconductor strip

This paper investigates the transient fracture behaviors of an eccentric crack in a n-type piezoelectric semiconductor (PSC) strip subjected to anti-plane shear mechanical and in-plane electrical impacts. By employing Laplace and Fourier transform, the mixed boundary value problem is reduced to a standard Cauchy singular integral equation of the first kind, which is subsequently solved numerically to obtain the dynamic field intensity factors and energy release rate near the crack tip. Numerical results demonstrate that material conductivity promotes crack propagation under mechanical loading but suppresses it under electrical loading. Furthermore, thinner PSC layers and cracks positioned closer to the boundaries significantly increase structural risks. These findings may provide valuable theoretical insights for optimizing the performance and ensuring the long-term reliability of PSC devices.