基于人工神经网络的SiC mosfet宽温度范围短路电热行为模型

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Shilong Yang , Linna Zhao , Xiaofeng Gu , Wai Tung Ng
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引用次数: 0

摘要

为了预测复杂电路系统中SiC mosfet的开关行为,提出了一种基于人工神经网络(ANN)的电模型与热网络模型相结合的混合建模方法。利用高漏源电压(VDS)条件下单脉冲短路(SC)试验的漏极电流(IDS)测量值对基于人工神经网络的电模型进行训练,以提高瞬态仿真精度。通过仿真和实验结果的综合比较,通过优化网络拓扑、权重和偏置选择,所提出的基于人工神经网络的电模型在25-100°C的宽温度范围内实现了0.63% ~ 18.9%的动态参数误差。此外,所提出的混合模型能够在极端SC条件下进行瞬态行为预测,模拟和测量的峰值SC电流之间的误差范围为1.22%至9.9%。此外,在100°C和125°C下进行的验证试验证实了模型的可靠温度预测性能,在100°C和125°C下,所有动态参数误差分别低于13.2%和41.65%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An artificial neural network based electro-thermal behavioral model for SiC MOSFETs operating under wide temperature range and short-circuit condition
To predict the switching behaviors of SiC MOSFETs in complex circuit systems, a hybrid modeling method combining an artificial neural network (ANN)-based electrical model with a thermal network model is proposed. The proposed ANN-based electrical model is trained using drain current (IDS) measurements obtained from single-pulse short-circuit (SC) tests under high drain-source voltage (VDS) conditions to improve transient simulation accuracy. Through comprehensive comparison between simulation and experimental results, the proposed ANN-based electrical model achieves dynamic parameter errors ranging from 0.63 % to 18.9 % across a wide temperature range (25–100 °C), achieved by optimized network topology, weights, and bias selection. Furthermore, the proposed hybrid model enables transient behavior prediction under extreme SC conditions, achieving errors between simulated and measured peak SC currents ranging from 1.22 % to 9.9 %. Furthermore, validation tests conducted at 100 °C and 125 °C confirm the model's reliable temperature prediction performance, with all dynamic parameter errors remaining below 13.2 % at 100 °C and 41.65 % at 125 °C, respectively.
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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