使用平顶和甜甜圈光束的短脉冲CO2激光器加工PTFE薄膜

IF 3.4 3区物理与天体物理 Q2 INSTRUMENTS & INSTRUMENTATION

Infrared Physics & Technology Pub Date : 2025-08-22 DOI:10.1016/j.infrared.2025.106100

Kazuyuki Uno, Katsunori Negishi

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引用次数: 0

摘要

聚四氟乙烯（PTFE）由于其光学特性，包括反射率、透射率和吸光度，对激光加工提出了挑战。PTFE在150 ~ 170 nm、7.8 ~ 8.9 μm、15.2 ~ 16.3 μm和17.8 ~ 20.3 μm的特定波长范围内具有较强的吸光度，而在其他波长范围内吸光度较低。CO2激光器的波长为10.6 μm，位于一个吸收带的边缘，200 μm厚的PTFE薄膜的反射率约为4%，透过率约为36%，吸光度约为60%。尽管有这些特点，聚四氟乙烯加工是可行的使用CO2激光。在本研究中，我们研究了使用平顶或甜甜圈光束的短脉冲CO2激光器对200 μm厚PTFE薄膜的钻孔和切割特性。在钻孔和切割中都实现了清洁加工，没有分解产物的附着。此外，通过调整光束形状和焦偏移量（焦平面与样品表面之间的距离），我们成功地控制了通孔钻孔中表面与侧壁之间的角度。

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Processing of PTFE films using a short-pulse CO2 laser with flat-top and doughnut beams

Polytetrafluoroethylene (PTFE) poses challenges for laser processing due to its optical properties, including reflectance, transmittance, and absorbance. PTFE exhibits strong absorption in specific wavelength ranges of 150 to 170 nm, 7.8 to 8.9 μm, 15.2 to 16.3 μm, and 17.8 to 20.3 μm, while its absorbance in other wavelength ranges is significantly lower. The wavelength of a CO₂ laser, 10.6 μm, lies at the edge of one absorption band, where the reflectance, transmittance and absorbance of a 200-μm-thick PTFE film are approximately 4 %, 36 % and 60 %, respectively. Despite these characteristics, PTFE processing is feasible using a CO₂ laser. In this study, we investigated the drilling and cutting characteristics of 200-μm-thick PTFE films using a short-pulse CO₂ laser with either a flat-top or doughnut beam. Clean processing, free from the attachment of decomposition products, was achieved in both drilling and cutting. Furthermore, by adjusting the beam shape and the focal offset, defined as the distance between the focal plane and the sample surface, we successfully controlled the angle between the surface and the sidewall in through-hole drilling.

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来源期刊

Infrared Physics & Technology 物理-光学

CiteScore

5.70

自引率

12.10%

发文量

400

审稿时长

67 days

期刊介绍： The Journal covers the entire field of infrared physics and technology: theory, experiment, application, devices and instrumentation. Infrared'' is defined as covering the near, mid and far infrared (terahertz) regions from 0.75um (750nm) to 1mm (300GHz.) Submissions in the 300GHz to 100GHz region may be accepted at the editors discretion if their content is relevant to shorter wavelengths. Submissions must be primarily concerned with and directly relevant to this spectral region. Its core topics can be summarized as the generation, propagation and detection, of infrared radiation; the associated optics, materials and devices; and its use in all fields of science, industry, engineering and medicine. Infrared techniques occur in many different fields, notably spectroscopy and interferometry; material characterization and processing; atmospheric physics, astronomy and space research. Scientific aspects include lasers, quantum optics, quantum electronics, image processing and semiconductor physics. Some important applications are medical diagnostics and treatment, industrial inspection and environmental monitoring.