2.5µm薄金锡金属化WLP滑动键合的定量溅射精确成分校准方法

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jianjun Ma;Qi Wei;Bin Zhou;Rong Zhang
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引用次数: 0

摘要

本文介绍了一种具有精确质量校准的2.5 μ m Au-Sn金属化的定量方法,该方法适用于微机电系统(MEMS)晶圆级封装(WLP)器件的固液互扩散键合,特别是那些需要面外电极微米级间隙的器件。对于Au-Sn金属化,传统的沉积方法,如电镀,由于对各种工艺条件的鲁棒性差,无法实现微米级的厚度和精确的成分。在本研究中,我们通过在溅射过程中直接进行质量测量和校准,进一步改善了沉积的Au-Sn合金的成分。实验采用0.1 mg分辨率的高精度天平在洁净室中测量溅射Au和Sn的质量增量。随后,计算了Sn靶材的溅射速率,并将其用于校准最终的Au-Sn组成。根据能量色散x射线能谱(EDS)结果,测量的Au-Sn质量组成与设定值的差异为1.1%,明显低于电镀Au-Sn焊料的典型5%-10%的成分偏差,表明有效校准增强了对变化条件的鲁棒性。试验结果表明,WLP组织的抗剪强度达到31.8 MPa,结合态Au-Sn合金的截面EDS结果与设计的Au-Sn成分一致。所提出的校准方法也可以应用于其他需要精确质量组成和微米级厚度的合金沉积,并且对变化条件具有更好的鲁棒性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Quantitative Sputtering Method for Accurate Composition Calibration of 2.5 µm Thin Au–Sn Metallization Enabling WLP SLID Bonding
This letter presents a quantitative approach for 2.5 µm Au–Sn metallization with accurate mass calibration, which is applied to solid–liquid interdiffusion bonding of microelectromechanical systems (MEMS) wafer-level packaging (WLP) devices, particularly those that demand a micron-level gap of out-of-plane electrodes. For Au–Sn metallization, traditional deposition methods, such as electroplating, are unable to achieve micron-level thickness and accurate composition due to poor robustness to varying process conditions. In this study, we further improve the composition of the deposited Au–Sn alloy through direct mass measurement and calibration during the cosputtering process. In the experiment, a high-precision balance with a resolution of 0.1 mg was utilized to measure the mass increment of sputtered Au and Sn in the clean room. Subsequently, the sputtering rate of the Sn target was calculated and applied to calibrate the final Au–Sn composition. According to the energy-dispersive X-ray spectrum (EDS) results, the difference between the measured Au–Sn mass composition and the set value is 1.1%, which is significantly lower than the typical 5%–10% composition deviation of electroplated Au–Sn solder, demonstrating a strengthened robustness to varying conditions by the effective calibration. The test results show that the shear strength of the WLP structure reaches 31.8 MPa, and the cross-sectional EDS results of the as-bonded Au–Sn alloy are consistent with the designed Au–Sn composition. The proposed calibration method can also be applied to other alloy depositions that require precise mass composition and micron-level thickness with a better robustness to varying conditions.
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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