三维积分中同轴- tgv温度瞬态分析的采样-双正交时域技术

IF 2.9 3区计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Pub Date : 2025-02-11 DOI:10.1109/TCAD.2025.3541011

K. Madhu Kiran;Rohit Dhiman

{"title":"三维积分中同轴- tgv温度瞬态分析的采样-双正交时域技术","authors":"K. Madhu Kiran;Rohit Dhiman","doi":"10.1109/TCAD.2025.3541011","DOIUrl":null,"url":null,"abstract":"A novel sampling-biorthogonal time-domain (SBTD) technique by considering the positive sampling basis and biorthogonal dual testing functions is developed to accurately model temperature-dependent crosstalk effects in circular and square coaxial-through glass vias (C-TGVs). An equivalent transmission-line model employing EM theory-based Bessel and Neumann functions to establish closed-form formulae for the frequency- and temperature-dependent resistance, inductance, capacitance, and conductance (per-unit-height) of both C-TGV configurations is presented. The efficacy of proposed SBTD technique is verified with SPICE results and conventional finite-difference time-domain (FDTD) technique. The SBTD technique proves more efficient with respect to FDTD, exhibiting less than 0.7% average error in estimating dynamic crosstalk-induced delay with lesser computational effort. Therefore, it is very useful for addressing the issues of electromagnetic interference and electromagnetic compatibility in 3-D integration.","PeriodicalId":13251,"journal":{"name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","volume":"44 9","pages":"3560-3570"},"PeriodicalIF":2.9000,"publicationDate":"2025-02-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration\",\"authors\":\"K. Madhu Kiran;Rohit Dhiman\",\"doi\":\"10.1109/TCAD.2025.3541011\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel sampling-biorthogonal time-domain (SBTD) technique by considering the positive sampling basis and biorthogonal dual testing functions is developed to accurately model temperature-dependent crosstalk effects in circular and square coaxial-through glass vias (C-TGVs). An equivalent transmission-line model employing EM theory-based Bessel and Neumann functions to establish closed-form formulae for the frequency- and temperature-dependent resistance, inductance, capacitance, and conductance (per-unit-height) of both C-TGV configurations is presented. The efficacy of proposed SBTD technique is verified with SPICE results and conventional finite-difference time-domain (FDTD) technique. The SBTD technique proves more efficient with respect to FDTD, exhibiting less than 0.7% average error in estimating dynamic crosstalk-induced delay with lesser computational effort. Therefore, it is very useful for addressing the issues of electromagnetic interference and electromagnetic compatibility in 3-D integration.\",\"PeriodicalId\":13251,\"journal\":{\"name\":\"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems\",\"volume\":\"44 9\",\"pages\":\"3560-3570\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2025-02-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10879559/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10879559/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}

引用次数: 0

摘要

提出了一种基于正采样基和双正交双测试函数的采样-双正交时域（SBTD）技术，用于精确模拟圆形和方形同轴玻璃通孔（c - tgv）中的温度相关串扰效应。利用基于EM理论的贝塞尔和诺伊曼函数建立了一个等效的传输在线模型，以建立两种C-TGV结构的频率和温度相关的电阻、电感、电容和电导（单位高度）的封闭形式公式。用SPICE实验结果和传统时域有限差分（FDTD）技术验证了该方法的有效性。SBTD技术被证明比FDTD更有效，在估计动态串扰引起的延迟时显示出小于0.7%的平均误差，计算量更少。因此，它对于解决三维集成中的电磁干扰和电磁兼容问题是非常有用的。

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Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration

A novel sampling-biorthogonal time-domain (SBTD) technique by considering the positive sampling basis and biorthogonal dual testing functions is developed to accurately model temperature-dependent crosstalk effects in circular and square coaxial-through glass vias (C-TGVs). An equivalent transmission-line model employing EM theory-based Bessel and Neumann functions to establish closed-form formulae for the frequency- and temperature-dependent resistance, inductance, capacitance, and conductance (per-unit-height) of both C-TGV configurations is presented. The efficacy of proposed SBTD technique is verified with SPICE results and conventional finite-difference time-domain (FDTD) technique. The SBTD technique proves more efficient with respect to FDTD, exhibiting less than 0.7% average error in estimating dynamic crosstalk-induced delay with lesser computational effort. Therefore, it is very useful for addressing the issues of electromagnetic interference and electromagnetic compatibility in 3-D integration.

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来源期刊

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 工程技术-工程：电子与电气

CiteScore

5.60

自引率

13.80%

发文量

500

审稿时长

7 months

期刊介绍： The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.