沉积层-基体界面对waam沉积SS316L疲劳裂纹扩展的影响：具有正交异性材料特性的XFEM模型

IF 3.8 3区工程技术 Q1 MECHANICS

International Journal of Solids and Structures Pub Date : 2025-08-15 DOI:10.1016/j.ijsolstr.2025.113616

Jignesh Nakrani , Amber Shrivastava , Wenyi Yan

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引用次数: 0

摘要

采用扩展有限元法（XFEM）研究了丝弧增材制造（WAAM）沉积在SS316基体上的SS316L合金界面处的疲劳裂纹扩展行为。该研究考虑了沿WAAM沉积和衬底界面具有四个缺口位置的紧致拉伸试样，以分析整体FCG行为。由于裂纹尖端的材料场不均匀，构筑方向裂纹偏离其初始轨迹，向WAAM区转移。即使在i型加载下，裂纹尖端的应力分布不均匀也会导致裂纹路径挠曲，这是由于WAAM区域的弹性模量小于基体。裂缝前缘附近的应力场提供了对裂缝扭结机制的深入了解。FCG行为的数值预测与实验观察结果吻合得很好。

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Effect of a deposit-substrate interface on fatigue crack propagation in WAAM-deposited SS316L: XFEM modeling with orthotropic material properties

The extended finite element method (XFEM) is used to investigate the fatigue crack growth (FCG) behavior at the interface of the SS316L deposited with wire arc additive manufacturing (WAAM) on SS316 substrate. The study considers compact tension specimens with four notch locations along the interface of WAAM deposition and substrate to analyze the overall FCG behavior. Build direction cracks divert from their initial trajectory towards WAAM region due to the uneven material field at the crack tip. Even with mode-I loading, crack path deflection is driven by the uneven stress distribution at the crack tip, which is caused due to WAAM region having smaller elastic modulus in comparison to the substrate. The stress field near the crack front provides insights into the crack-kinking mechanism. Numerical predictions of FCG behavior align well with experimental observations.

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来源期刊

International Journal of Solids and Structures 物理-力学

CiteScore

6.70

自引率

8.30%

发文量

405

审稿时长

70 days

期刊介绍： The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field. Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.