一种测量可插入多层介质厚度的双峰可伸缩电传感器

IF 4.3 2区综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Sensors Journal Pub Date : 2025-07-21 DOI:10.1109/JSEN.2025.3586065

Yuwei Zhao;Shihong Yue;Ning Liu

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引用次数: 0

摘要

可插入多层介质的厚度是工业生产过程中的一个重要参数，但当多层介质同时含有导电介质和非导电介质时，厚度测量仍然不准确。为了解决这个问题，设计了一种双峰可扩展的电传感器，它包括电阻层析成像（ERT）传感器和电容层析成像（ECT）传感器。ERT可以测量导电介质，ECT可以测量非导电介质。此外，该传感器可扩展以获得更精确的测量。根据ECT和ERT的结构，提出了测量多层介质厚度的有效计算方法，并通过仿真和实验验证了双峰和可扩展传感器的优势。因此，该传感器及其相关计算方法可为更广泛的工业领域层状介质厚度测量提供有效和实用的基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Bimodal Scalable Electrical Sensor for Measuring the Thickness of Insertable Multilayer Media

The thickness of insertable multilayer media is an important parameter in industrial processes, but the thickness measurement remains inaccurate when various layers consist of both conductive and nonconductive media. To address the issue, a bimodal scalable electrical sensor is designed, and it comprises both electrical resistance tomography (ERT) sensors and the electrical capacitance tomography (ECT) sensors. ERT can measure conductive medium whereas ECT can do nonconductive one. Moreover, the sensor is scalable to obtain more accurate measurements. According to the structures of both ECT and ERT, we propose the effective computation methods for measuring the thickness of multilayer media, and the advantages of the bimodal and scalable sensor are verified by simulations and experiments. Consequently, the new sensor and the related computation methods can serve as an effective and practical basis for measuring the thickness of layered media in broader industrial fields.

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来源期刊

IEEE Sensors Journal 工程技术-工程：电子与电气

CiteScore

7.70

自引率

14.00%

发文量

2058

审稿时长

5.2 months

期刊介绍： The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice