Jiapeng Chen , Yanan Peng , Ying Wei , Yulong Ding , Ke Dai , Bing Liu , Wenbo Bie , Jianxiu Su
{"title":"固定团块金刚石磨料研磨中改进材料去除机理的数学模型","authors":"Jiapeng Chen , Yanan Peng , Ying Wei , Yulong Ding , Ke Dai , Bing Liu , Wenbo Bie , Jianxiu Su","doi":"10.1016/j.precisioneng.2025.08.006","DOIUrl":null,"url":null,"abstract":"<div><div>The manufacture of agglomerated diamond (AD) abrasives involves the combination of ceramic adhesives with single - crystal diamond (SCD) abrasives. This combination results in an abrasive that plays a pivotal role in the semiconductor production process, thus making it an integral material in the manufacturing process. Nevertheless, there exists a notable paucity of numerical and analytical models capable of comprehensively and precisely expounding upon the enhanced material - removal mechanism in the processing of lapping superhard and brittle semiconductor workpieces with fixed AD abrasives. In this treatise, the AD abrasive is ingeniously converted into an equivalent SCD abrasive. Based on the previous research on the removal model of superhard and brittle materials in the fixed SCD abrasive lapping, this paper has deepened the field. The mechanism of material removal and enhancement in fixed AD abrasive lapping was investigated in detail by using an equivalent single - crystal model. A comprehensive review of the interaction of physical and chemical factors aims to achieve efficient and accurate material removal, providing a theoretical basis and technical guidance for the precision machining of superhard and brittle materials. Through a scrupulous and detailed comparison of the correlations between the penetration depths of the AD and SCD abrasives into the sapphire wafer and the deformations occurring during the yielding process in the two types of abrasives incorporated into the matrix material of the fixed abrasive pad (FAP) that is intended to support the abrasives, an exhaustive exploration is carried out on the mapping between the FAP matrix characteristics and lapping parameters and the abrasive cutting depths. Consequently, the underlying and profound causes for the mechanism of performance improvement of fixed AD abrasive pads during material removal are clearly and systematically elucidated and summarized, thereby providing valuable insights and contributions to the relevant research domain.</div></div>","PeriodicalId":54589,"journal":{"name":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","volume":"96 ","pages":"Pages 822-839"},"PeriodicalIF":3.7000,"publicationDate":"2025-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A mathematical model on improved material removal mechanism in fixed agglomerated diamond abrasive lapping\",\"authors\":\"Jiapeng Chen , Yanan Peng , Ying Wei , Yulong Ding , Ke Dai , Bing Liu , Wenbo Bie , Jianxiu Su\",\"doi\":\"10.1016/j.precisioneng.2025.08.006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The manufacture of agglomerated diamond (AD) abrasives involves the combination of ceramic adhesives with single - crystal diamond (SCD) abrasives. This combination results in an abrasive that plays a pivotal role in the semiconductor production process, thus making it an integral material in the manufacturing process. Nevertheless, there exists a notable paucity of numerical and analytical models capable of comprehensively and precisely expounding upon the enhanced material - removal mechanism in the processing of lapping superhard and brittle semiconductor workpieces with fixed AD abrasives. In this treatise, the AD abrasive is ingeniously converted into an equivalent SCD abrasive. Based on the previous research on the removal model of superhard and brittle materials in the fixed SCD abrasive lapping, this paper has deepened the field. The mechanism of material removal and enhancement in fixed AD abrasive lapping was investigated in detail by using an equivalent single - crystal model. A comprehensive review of the interaction of physical and chemical factors aims to achieve efficient and accurate material removal, providing a theoretical basis and technical guidance for the precision machining of superhard and brittle materials. Through a scrupulous and detailed comparison of the correlations between the penetration depths of the AD and SCD abrasives into the sapphire wafer and the deformations occurring during the yielding process in the two types of abrasives incorporated into the matrix material of the fixed abrasive pad (FAP) that is intended to support the abrasives, an exhaustive exploration is carried out on the mapping between the FAP matrix characteristics and lapping parameters and the abrasive cutting depths. Consequently, the underlying and profound causes for the mechanism of performance improvement of fixed AD abrasive pads during material removal are clearly and systematically elucidated and summarized, thereby providing valuable insights and contributions to the relevant research domain.</div></div>\",\"PeriodicalId\":54589,\"journal\":{\"name\":\"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology\",\"volume\":\"96 \",\"pages\":\"Pages 822-839\"},\"PeriodicalIF\":3.7000,\"publicationDate\":\"2025-08-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0141635925002442\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0141635925002442","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
A mathematical model on improved material removal mechanism in fixed agglomerated diamond abrasive lapping
The manufacture of agglomerated diamond (AD) abrasives involves the combination of ceramic adhesives with single - crystal diamond (SCD) abrasives. This combination results in an abrasive that plays a pivotal role in the semiconductor production process, thus making it an integral material in the manufacturing process. Nevertheless, there exists a notable paucity of numerical and analytical models capable of comprehensively and precisely expounding upon the enhanced material - removal mechanism in the processing of lapping superhard and brittle semiconductor workpieces with fixed AD abrasives. In this treatise, the AD abrasive is ingeniously converted into an equivalent SCD abrasive. Based on the previous research on the removal model of superhard and brittle materials in the fixed SCD abrasive lapping, this paper has deepened the field. The mechanism of material removal and enhancement in fixed AD abrasive lapping was investigated in detail by using an equivalent single - crystal model. A comprehensive review of the interaction of physical and chemical factors aims to achieve efficient and accurate material removal, providing a theoretical basis and technical guidance for the precision machining of superhard and brittle materials. Through a scrupulous and detailed comparison of the correlations between the penetration depths of the AD and SCD abrasives into the sapphire wafer and the deformations occurring during the yielding process in the two types of abrasives incorporated into the matrix material of the fixed abrasive pad (FAP) that is intended to support the abrasives, an exhaustive exploration is carried out on the mapping between the FAP matrix characteristics and lapping parameters and the abrasive cutting depths. Consequently, the underlying and profound causes for the mechanism of performance improvement of fixed AD abrasive pads during material removal are clearly and systematically elucidated and summarized, thereby providing valuable insights and contributions to the relevant research domain.
期刊介绍:
Precision Engineering - Journal of the International Societies for Precision Engineering and Nanotechnology is devoted to the multidisciplinary study and practice of high accuracy engineering, metrology, and manufacturing. The journal takes an integrated approach to all subjects related to research, design, manufacture, performance validation, and application of high precision machines, instruments, and components, including fundamental and applied research and development in manufacturing processes, fabrication technology, and advanced measurement science. The scope includes precision-engineered systems and supporting metrology over the full range of length scales, from atom-based nanotechnology and advanced lithographic technology to large-scale systems, including optical and radio telescopes and macrometrology.