WC-HEA硬质合金磨削过程中韧脆性去除转变研究

IF 2.3 4区 材料科学 Q2 MATERIALS SCIENCE, CERAMICS
Xueliang Li, Jin Du, Guosheng Su, Peirong Zhang, Yujing Sun, Binxun Li, Yan Xia
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引用次数: 0

摘要

高熵硬质合金(tungsten carbide - high-entropy alloy [WC-HEA])是近年来发展起来的一类新型超硬材料,具有高强度、高硬度、高耐磨性等优异的力学性能。然而,在磨削过程中控制其表面形成的基本机制仍然知之甚少。本研究通过逐深单粒划伤实验结合理论建模,系统地研究了岩石的韧性-脆性转变行为。在严格控制的条件下进行了划痕力、表面形貌演变和三维形貌的实验表征。基于Griffith能量平衡准则和压痕断裂力学理论,建立了临界切削深度的预测模型。刻划实验结果揭示了三种不同的材料去除机制:(1)以韧性为主的去除(刻划深度<;0.802µm)产生无缺陷表面。(2)过渡区(0.802 ~ 2.53µm)以间歇性裂纹萌生为特征(在0.802µm处观察到第一个大裂纹)。(3)脆性断裂为主的去除(>2.53µm)表现出严重的表面损伤。横断面扫描电镜(SEM)分析证实,在韧性去除模式下不存在晶格缺陷,而脆性去除模式下WC/HEA界面沿晶间开裂。实验过渡阈值与理论预测有15%的偏差,验证了所提出的模型。这项工作为实现WC-HEA复合材料的无损伤加工建立了理论框架,对精密制造应用中的高质量表面加工具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Study on ductile/brittle removal transition during grinding of WC–HEA cemented carbide

Study on ductile/brittle removal transition during grinding of WC–HEA cemented carbide

Study on ductile/brittle removal transition during grinding of WC–HEA cemented carbide

High-entropy cemented carbide (tungsten carbide–high-entropy alloy [WC–HEA]), as a novel class of ultrahard materials developed in recent years, exhibits exceptional mechanical properties including high strength, hardness, and wear resistance. However, the fundamental mechanisms governing its surface formation during grinding processes remain poorly understood. This study systematically investigates the ductile–brittle transition behavior through progressive-depth single-grit scratch experiments combined with theoretical modeling. Experimental characterization of scratch forces, surface morphology evolution, and three-dimensional morphology was conducted under strictly controlled conditions. A predictive model for critical cutting depth was developed based on the Griffith energy balance criterion and indentation fracture mechanics theory. The scratching experiment results reveal three distinct material removal regimes: (1) Ductile-dominated removal (scratching depth <0.802 µm) producing defect-free surfaces. (2) Transition regime (0.802–2.53 µm) characterized by intermittent crack initiation (first macrocrack observed at 0.802 µm). (3) Brittle fracture-dominated removal (>2.53 µm) exhibiting severe surface damage. Cross-sectional scanning electron microscopy (SEM) analysis confirmed the absence of lattice defects in ductile removal mode processing, while brittle removal mode showed intergranular cracking along WC/HEA interfaces. The experimental transition thresholds show <15% deviation from theoretical predictions, validating the proposed model. This work establishes a theoretical framework for achieving damage-free machining of WC–HEA composites, with critical implications for high-quality surface processing in precision manufacturing applications.

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来源期刊
International Journal of Applied Ceramic Technology
International Journal of Applied Ceramic Technology 工程技术-材料科学:硅酸盐
CiteScore
3.90
自引率
9.50%
发文量
280
审稿时长
4.5 months
期刊介绍: The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas: Nanotechnology applications; Ceramic Armor; Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors); Ceramic Matrix Composites; Functional Materials; Thermal and Environmental Barrier Coatings; Bioceramic Applications; Green Manufacturing; Ceramic Processing; Glass Technology; Fiber optics; Ceramics in Environmental Applications; Ceramics in Electronic, Photonic and Magnetic Applications;
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