{"title":"黏附条件下埋置环氧树脂中纳米填料和网状结构空间分布的无损评价","authors":"Hiroki Ogawa*, Naoto Tobita, Shunsuke Ono, Pangpang Wang, Tatsuya Kubozono, Daisuke Yoshihara, Sunao Yamada, Masato Arakawa, Satoru Yamamoto, Keiji Tanaka and Mikihito Takenaka, ","doi":"10.1021/acsapm.5c01755","DOIUrl":null,"url":null,"abstract":"<p >A combined medium-angle X-ray scattering (MAXS) and computed tomography (CT) method was nondestructively applied to a buried epoxy resin sample. We successfully visualized the spatial distribution of the silica nanoparticle fillers and networks inside the filler-containing epoxy resin. Epoxy samples were prepared by gluing two aluminum plates together and creating an air-exposed area at the edge of the sample. When the mixing time of HDGEBA (epoxy agent) and CBMA (curing agent) containing silica nanoparticles with phenylsilane-modified surfaces is short, the silica nanoparticles tend to accumulate along the edge. This heterogeneous distribution is reduced by increasing the mixing time, regardless of the curing temperature. The spatial distribution of the network density, i.e., the cross-linked structures, also shows heterogeneity. An increase in the mixing time leads to suppression of heterogeneity. However, complete homogeneity is not obtained, and the network density distribution on the edge side becomes heterogeneous. This distribution becomes more pronounced at higher curing temperatures. CBMA diffuses to the edge, and the curing reaction rapidly proceeds because of factors such as the high molecular mobility at the free surface. These factors result in an increase in the network density. In contrast, when cured at a low temperature, CBMA forms crystalline structures. This crystallization reduces the network density. Thus, the high network density at the free surface is suppressed, resulting in a relatively homogeneous distribution of the network density throughout the sample. The findings from this study provide valuable insights into the design of epoxy curing agents and optimization of adhesive properties. Specifically, the silica nanoparticle distribution and the network density can be tuned by controlling the mixing time and curing temperature, which can lead to enhanced mechanical properties and improved adhesion performance in practical applications.</p>","PeriodicalId":7,"journal":{"name":"ACS Applied Polymer Materials","volume":"7 15","pages":"10051–10061"},"PeriodicalIF":4.7000,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nondestructive Evaluation of the Spatial Distribution of Nanofillers and Network Structures in Buried Epoxy Resins under Adhesion Conditions\",\"authors\":\"Hiroki Ogawa*, Naoto Tobita, Shunsuke Ono, Pangpang Wang, Tatsuya Kubozono, Daisuke Yoshihara, Sunao Yamada, Masato Arakawa, Satoru Yamamoto, Keiji Tanaka and Mikihito Takenaka, \",\"doi\":\"10.1021/acsapm.5c01755\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >A combined medium-angle X-ray scattering (MAXS) and computed tomography (CT) method was nondestructively applied to a buried epoxy resin sample. We successfully visualized the spatial distribution of the silica nanoparticle fillers and networks inside the filler-containing epoxy resin. Epoxy samples were prepared by gluing two aluminum plates together and creating an air-exposed area at the edge of the sample. When the mixing time of HDGEBA (epoxy agent) and CBMA (curing agent) containing silica nanoparticles with phenylsilane-modified surfaces is short, the silica nanoparticles tend to accumulate along the edge. This heterogeneous distribution is reduced by increasing the mixing time, regardless of the curing temperature. The spatial distribution of the network density, i.e., the cross-linked structures, also shows heterogeneity. An increase in the mixing time leads to suppression of heterogeneity. However, complete homogeneity is not obtained, and the network density distribution on the edge side becomes heterogeneous. This distribution becomes more pronounced at higher curing temperatures. CBMA diffuses to the edge, and the curing reaction rapidly proceeds because of factors such as the high molecular mobility at the free surface. These factors result in an increase in the network density. In contrast, when cured at a low temperature, CBMA forms crystalline structures. This crystallization reduces the network density. Thus, the high network density at the free surface is suppressed, resulting in a relatively homogeneous distribution of the network density throughout the sample. The findings from this study provide valuable insights into the design of epoxy curing agents and optimization of adhesive properties. Specifically, the silica nanoparticle distribution and the network density can be tuned by controlling the mixing time and curing temperature, which can lead to enhanced mechanical properties and improved adhesion performance in practical applications.</p>\",\"PeriodicalId\":7,\"journal\":{\"name\":\"ACS Applied Polymer Materials\",\"volume\":\"7 15\",\"pages\":\"10051–10061\"},\"PeriodicalIF\":4.7000,\"publicationDate\":\"2025-07-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Polymer Materials\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://pubs.acs.org/doi/10.1021/acsapm.5c01755\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Polymer Materials","FirstCategoryId":"92","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsapm.5c01755","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Nondestructive Evaluation of the Spatial Distribution of Nanofillers and Network Structures in Buried Epoxy Resins under Adhesion Conditions
A combined medium-angle X-ray scattering (MAXS) and computed tomography (CT) method was nondestructively applied to a buried epoxy resin sample. We successfully visualized the spatial distribution of the silica nanoparticle fillers and networks inside the filler-containing epoxy resin. Epoxy samples were prepared by gluing two aluminum plates together and creating an air-exposed area at the edge of the sample. When the mixing time of HDGEBA (epoxy agent) and CBMA (curing agent) containing silica nanoparticles with phenylsilane-modified surfaces is short, the silica nanoparticles tend to accumulate along the edge. This heterogeneous distribution is reduced by increasing the mixing time, regardless of the curing temperature. The spatial distribution of the network density, i.e., the cross-linked structures, also shows heterogeneity. An increase in the mixing time leads to suppression of heterogeneity. However, complete homogeneity is not obtained, and the network density distribution on the edge side becomes heterogeneous. This distribution becomes more pronounced at higher curing temperatures. CBMA diffuses to the edge, and the curing reaction rapidly proceeds because of factors such as the high molecular mobility at the free surface. These factors result in an increase in the network density. In contrast, when cured at a low temperature, CBMA forms crystalline structures. This crystallization reduces the network density. Thus, the high network density at the free surface is suppressed, resulting in a relatively homogeneous distribution of the network density throughout the sample. The findings from this study provide valuable insights into the design of epoxy curing agents and optimization of adhesive properties. Specifically, the silica nanoparticle distribution and the network density can be tuned by controlling the mixing time and curing temperature, which can lead to enhanced mechanical properties and improved adhesion performance in practical applications.
期刊介绍:
ACS Applied Polymer Materials is an interdisciplinary journal publishing original research covering all aspects of engineering, chemistry, physics, and biology relevant to applications of polymers.
The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates fundamental knowledge in the areas of materials, engineering, physics, bioscience, polymer science and chemistry into important polymer applications. The journal is specifically interested in work that addresses relationships among structure, processing, morphology, chemistry, properties, and function as well as work that provide insights into mechanisms critical to the performance of the polymer for applications.