黏附条件下埋置环氧树脂中纳米填料和网状结构空间分布的无损评价

IF 4.7 2区 化学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Hiroki Ogawa*, Naoto Tobita, Shunsuke Ono, Pangpang Wang, Tatsuya Kubozono, Daisuke Yoshihara, Sunao Yamada, Masato Arakawa, Satoru Yamamoto, Keiji Tanaka and Mikihito Takenaka, 
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引用次数: 0

摘要

采用中角x射线散射(MAXS)和计算机断层扫描(CT)相结合的方法对环氧树脂样品进行了无损检测。我们成功地可视化了二氧化硅纳米颗粒填料的空间分布和填充环氧树脂内部的网络。环氧树脂样品是通过将两块铝板粘合在一起并在样品边缘形成一个空气暴露区域来制备的。当含有二氧化硅纳米颗粒的环氧剂HDGEBA和固化剂CBMA与苯基硅烷改性表面混合时间较短时,二氧化硅纳米颗粒倾向于沿边缘堆积。无论固化温度如何,增加混合时间都可以减少这种不均匀分布。网络密度的空间分布,即交联结构也表现出异质性。增加混合时间可以抑制非均质性。但是没有得到完全的均匀性,边缘侧的网络密度分布变得不均匀。这种分布在较高的固化温度下变得更加明显。由于自由表面的高分子迁移率等因素,CBMA扩散到边缘,固化反应迅速进行。这些因素导致网络密度增加。相反,当低温固化时,CBMA形成结晶结构。这种结晶降低了网络密度。因此,自由表面的高网络密度被抑制,导致整个样品的网络密度分布相对均匀。本研究结果为环氧固化剂的设计和胶粘剂性能的优化提供了有价值的见解。具体而言,通过控制混合时间和固化温度,可以调节纳米二氧化硅的分布和网络密度,从而在实际应用中增强机械性能和改善粘附性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Nondestructive Evaluation of the Spatial Distribution of Nanofillers and Network Structures in Buried Epoxy Resins under Adhesion Conditions

Nondestructive Evaluation of the Spatial Distribution of Nanofillers and Network Structures in Buried Epoxy Resins under Adhesion Conditions

A combined medium-angle X-ray scattering (MAXS) and computed tomography (CT) method was nondestructively applied to a buried epoxy resin sample. We successfully visualized the spatial distribution of the silica nanoparticle fillers and networks inside the filler-containing epoxy resin. Epoxy samples were prepared by gluing two aluminum plates together and creating an air-exposed area at the edge of the sample. When the mixing time of HDGEBA (epoxy agent) and CBMA (curing agent) containing silica nanoparticles with phenylsilane-modified surfaces is short, the silica nanoparticles tend to accumulate along the edge. This heterogeneous distribution is reduced by increasing the mixing time, regardless of the curing temperature. The spatial distribution of the network density, i.e., the cross-linked structures, also shows heterogeneity. An increase in the mixing time leads to suppression of heterogeneity. However, complete homogeneity is not obtained, and the network density distribution on the edge side becomes heterogeneous. This distribution becomes more pronounced at higher curing temperatures. CBMA diffuses to the edge, and the curing reaction rapidly proceeds because of factors such as the high molecular mobility at the free surface. These factors result in an increase in the network density. In contrast, when cured at a low temperature, CBMA forms crystalline structures. This crystallization reduces the network density. Thus, the high network density at the free surface is suppressed, resulting in a relatively homogeneous distribution of the network density throughout the sample. The findings from this study provide valuable insights into the design of epoxy curing agents and optimization of adhesive properties. Specifically, the silica nanoparticle distribution and the network density can be tuned by controlling the mixing time and curing temperature, which can lead to enhanced mechanical properties and improved adhesion performance in practical applications.

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来源期刊
CiteScore
7.20
自引率
6.00%
发文量
810
期刊介绍: ACS Applied Polymer Materials is an interdisciplinary journal publishing original research covering all aspects of engineering, chemistry, physics, and biology relevant to applications of polymers. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates fundamental knowledge in the areas of materials, engineering, physics, bioscience, polymer science and chemistry into important polymer applications. The journal is specifically interested in work that addresses relationships among structure, processing, morphology, chemistry, properties, and function as well as work that provide insights into mechanisms critical to the performance of the polymer for applications.
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