新型稀土混合磨料绿色化学机械抛光铝合金原子表面及其机理

IF 5.1 3区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Nanoscale Pub Date : 2025-08-07 DOI:10.1039/D5NR02599K
Zeyun Wang, Zhenyu Zhang, Pengfei Hu, Ganggang Liu, Jianjun Hu, Jianan Xu, Huaxiang Cai, Zehong Pang and Peng Ding
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引用次数: 0

摘要

铝(Al)合金是一种柔软的塑料状金属,容易嵌入磨料、划痕、腐蚀坑和变形。在铝合金表面实现原子光滑是一个重大的挑战。本研究介绍了一种新型绿色化学机械抛光(CMP)技术,该技术使用双氧水、酪氨酸、碳酸钠和由二氧化硅、氧化钇和氧化铈组成的杂化磨料。该方法在50×50 μm2扫描面积上的表面粗糙度(Sa)为0.187 nm,材料去除率为17.23 μm/h。透射电镜(TEM)分析显示损伤层厚度为3.6 nm。据我们所知,这项工作报告了迄今为止最低的Sa和铝合金损伤层厚度。采用分子动力学模拟方法对纳米刮擦过程中材料的动态去除机理进行了研究。当切割深度从2.5 nm增加到3 nm时,损伤层的厚度在3.5 nm到4.3 nm之间变化,这与透射电镜的结果很好地吻合。记录到的最大von Mises应力为7.98 GPa,出现位错环、空位缺陷、层错和非晶态相。水中二氧化硅、水中二氧化硅和氧化钇、pH = 10时二氧化硅、pH = 10时二氧化硅和氧化钇的zeta电位分别为-22.78、-9.46、-34.03和-41.55 mV。对应的多分散性指数分别为0.281、0.412、0.231和0.185。这些数据表明,二氧化硅和钇混合磨料在碳酸钠溶液中表现出最好的稳定性和分散性。表征技术,包括x射线光电子能谱、傅里叶变换红外能谱和拉曼能谱,证明了过氧化氢在氧化铝合金表面形成氢氧化铝、氧化铝和二氧化硅中的作用。所提出的络合公式表明,酪氨酸与Al3+离子形成络合物,而二氧化铈与二氧化硅反应。杂化磨料有助于氧化物和配合物的去除。提出的新型绿色CMP方法为实现铝合金原子级表面光滑提供了新的途径,有可能增强其在高性能器件中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

An atomic surface of an aluminum alloy induced by novel green chemical mechanical polishing using hybrid rare earth abrasives and mechanisms unraveled

An atomic surface of an aluminum alloy induced by novel green chemical mechanical polishing using hybrid rare earth abrasives and mechanisms unraveled

An aluminum (Al) alloy is a soft, plastic-like metal that is prone to embedding abrasives, scratches, corrosion pits, and deformation. Achieving an atomically smooth surface on an Al alloy presents a significant challenge. This study introduces a novel green chemical mechanical polishing (CMP) technique using hydrogen peroxide, tyrosine, sodium carbonate, and hybrid abrasives composed of silica, yttria, and ceria. The method produces a surface roughness (Sa) of 0.187 nm over a 50 × 50 μm2 scanning area, with a material removal rate of 17.23 μm h−1. Transmission electron microscopy (TEM) analysis shows a damaged layer thickness of 3.6 nm. To the best of our knowledge, this work reports the lowest Sa and damaged layer thickness for Al alloys to date. Molecular dynamics simulations are used to elucidate the mechanism of dynamic material removal during nanoscratching. As the cutting depth increases from 2.5 to 3 nm, the thickness of the damaged layer varies from 3.5 to 4.3 nm, aligning well with the TEM findings. The maximum von Mises stress recorded is 7.98 GPa, with the appearance of dislocation loops, vacancy defects, stacking faults, and an amorphous phase. The zeta potential measurements are −22.78, −9.46, −34.03, and −41.55 mV for silica in water, silica and yttria in water, silica at a pH of 10, and silica and yttria at a pH of 10, respectively. These correspond to polydispersity indices of 0.281, 0.412, 0.231, and 0.185. These data indicate that the hybrid abrasives of silica and yttria in a sodium carbonate solution exhibit the best stability and dispersion among the tested solutions. Characterization techniques, including X-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and Raman spectroscopy, demonstrate the role of hydrogen peroxide in oxidizing the Al alloy surface to form aluminum hydroxide, alumina, and silica. Proposed complexing formulas suggest that tyrosine forms complexes with Al3+ ions, while ceria reacts with silica. The removal of oxides and complexes is facilitated by hybrid abrasives. The proposed novel green CMP method offers a new pathway for achieving atomic-level surface smoothness on Al alloys, potentially enhancing their application in high-performance devices.

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来源期刊
Nanoscale
Nanoscale CHEMISTRY, MULTIDISCIPLINARY-NANOSCIENCE & NANOTECHNOLOGY
CiteScore
12.10
自引率
3.00%
发文量
1628
审稿时长
1.6 months
期刊介绍: Nanoscale is a high-impact international journal, publishing high-quality research across nanoscience and nanotechnology. Nanoscale publishes a full mix of research articles on experimental and theoretical work, including reviews, communications, and full papers.Highly interdisciplinary, this journal appeals to scientists, researchers and professionals interested in nanoscience and nanotechnology, quantum materials and quantum technology, including the areas of physics, chemistry, biology, medicine, materials, energy/environment, information technology, detection science, healthcare and drug discovery, and electronics.
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