基板集成阻抗曲面的理论建模

IF 5.8 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Asim Al-Khaibari;Nanshu Wu;Hakan Bağci;Danilo Erricolo;Pai-Yen Chen
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引用次数: 0

摘要

衬底集成阻抗表面(SIISs)或衬底集成超表面(sim)最近被提出用于定制波导、谐振器和腔天线的色散和本征模式,以及开发具有增强超耦合、电场定位和对扰动敏感的可重构的epsilon-near-zero (ENZ)通道。在这里,我们提出了一个紧凑的分析模型,用于计算由嵌入在基板集成波导(SIW)中的1-D盲通孔阵列形成的电容性SIIS的有效表面阻抗。通过数值算例和仿真验证了分析模型,即使对于由非稀释和密集的盲孔阵列组成的sisi也具有良好的精度。我们的理论结果可能有利于siis加载技术和SIWs,这对于实现下一代微波/毫米波通信,传感和腔量子电动力学(cQED)系统的全部潜力至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Theoretical Modeling of Substrate-Integrated Impedance Surfaces
Substrate-integrated impedance surfaces (SIISs) or substrate-integrated metasurfaces (SIMSs) have recently been proposed to tailor the dispersion and eigenmodes of waveguides, resonators, and cavity antennas, as well as to develop reconfigurable epsilon-near-zero (ENZ) channels with enhanced supercoupling, electric field localization, and sensitivity to perturbations. Here, we present a compact analytical model for calculating the effective surface impedance of the capacitive SIIS formed by a 1-D array of blind vias embedded in a substrate-integrated waveguide (SIW). The analytical model is validated using numerical examples and simulations, achieving good accuracy even for SIISs consisting of the non-diluted and dense array of blind vias. Our theoretical results may be beneficial for SIIS-loading techniques and SIWs, which are critical to realizing the full potential of the next-generation microwave/millimeter-wave communication, sensing, and cavity quantum electrodynamics (cQED) systems.
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来源期刊
CiteScore
10.40
自引率
28.10%
发文量
968
审稿时长
4.7 months
期刊介绍: IEEE Transactions on Antennas and Propagation includes theoretical and experimental advances in antennas, including design and development, and in the propagation of electromagnetic waves, including scattering, diffraction, and interaction with continuous media; and applications pertaining to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques
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