Dynamic Heat Dissipation in Electronics Using Nano-Encapsulated Phase Change Material and Hybrid Convection–Radiation Strategies

Thermal regulation in miniaturized electronics with heterogeneous heat generation profiles has emerged as a pivotal challenge for sustaining performance and reliability in next-generation technologies. To address these thermal challenges, this study explores an electronic cooling system combining nano-encapsulated phase change material (NEPCM) with convection–radiation coupling. The system features a partitioned cavity with three different heat-generating blocks, divided by a conductive plate into an open section (cooled by natural convection and radiation) and a porous closed section saturated with NEPCM. Using the Galerkin finite element method, cooling efficiency is analyzed across critical parameters: PCM properties (melting temperature T_f = 300–315 K, Stefan number Ste = 0.4–1), plate geometry (thickness e = 0.04–0.24 cm, displacement d = 2.7–3.6 cm), radiative effects (emissivity ε = 0.1–0.9), nanoparticle concentration (%), porous media (Da = 10⁻⁵–10⁻²) and the cavity inclination angle ($\alpha =-90^{°}$ to $90^{°}$). The findings reveal that the maximum temperatures of the blocks can vary significantly, with reductions exceeding 7% when key parameters, such as Darcy number and cavity inclination angle, are optimized. In contrast, other parameters have a more limited influence, resulting in variations not exceeding 2%. These insights highlight the importance of selecting appropriate parameters for enhanced thermal management in electronic applications.