类忆阻器谐振传感器:MEMS谐振器内缩紧迟滞的观察

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Erion Uka;Chun Zhao
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引用次数: 0

摘要

忆阻器的独特特征是其收缩的磁滞环指纹,由于其在新型计算和人工智能应用方面的巨大潜力,在过去十年中吸引了大量的研究兴趣。忆阻器被广泛认为是第四种基本的电子元件,电压和电流是它们的输入和输出信号。从广义上讲,类似的挤压迟滞行为也应该存在于跨域(例如,物理输入和电输出)的其他物理系统中,从而将真实的物理世界与数字域(例如,以物理传感器的形式)联系起来。在这项工作中,我们报告了在微机电系统(MEMS)谐振器器件中首次观察到的挤压迟滞行为,表明创建具有类似忆阻器特性的谐振MEMS传感器(即memressensor)是可行的。我们设想这将为融合MEMS与人工智能(AI)的新方法奠定基础,例如创建物理传感器计算,以及传感器内AI,例如跨域的多模式传感器内矩阵乘法。(2025 - 0029)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Toward Memristor-Like Resonant Sensors: Observation of Pinched Hysteresis Within MEMS Resonators
Memristors, uniquely characterized by their pinched hysteresis loop fingerprints, have attracted significant research interest over the past decade, due to their enormous potential for novel computation and artificial intelligence applications. Memristors are widely regarded as the fourth fundamental electrical component, with voltage and current being their input and output signals. In broader terms, similar pinched hysteresis behavior should also exist in other physical systems across domains (e.g., physical input and electrical output), hence linking the real physical world with the digital domain (e.g., in the form of a physical sensor). In this work, we report the first observation of pinched hysteresis behavior in a micro-electro-mechanical systems (MEMS) resonator device, showing that it is viable to create resonant MEMS sensors incorporating memristor-like properties, i.e., MemReSensor. We envisage that this will lay the foundations for a new way of fusing MEMS with artificial intelligence (AI), such as creating in-physical-sensor computing, as well as in-sensor AI, e.g., multi-mode in-sensor matrix multiplication across domains. [2025-0029]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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