利用圆柱弯曲CMOS图像传感器校正场曲率像差

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Shigeyuki Imura;Masahide Goto;Hiroto Sato
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引用次数: 0

摘要

我们演示了采用圆柱弯曲互补金属氧化物半导体(CMOS)图像传感器的透镜的横向场曲率像差校正,而无需使用多个透镜。通过采用绝缘体上硅(SOI)结构并使用氟化氙(${\ mathm {XeF}}_{{2}})进行蚀刻,我们制造了厚度为11- $\mu $ m的极薄CMOS图像传感器,而不会损坏CMOS电路。由于SOI的结构特点,即极薄的厚度和高的SiO2含量,制作的CMOS图像传感器具有柔性,即使弯曲也不易断裂。该器件在凹面上弯曲,固定在圆柱形底座上,并通过线键合安装在封装上,实现曲率半径为20 mm的圆柱形弯曲CMOS图像传感器。利用所制备的CMOS图像传感器,我们成功地捕获了视频图像(320\ × 240$像素)。将这些图像与从平面CMOS图像传感器获得的图像进行比较表明,通过弯曲CMOS图像传感器,可以使用单个透镜减少图像侧面边缘的模糊。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Field Curvature Aberration Correction Using Cylindrically Curved CMOS Image Sensors
We demonstrate the lateral field curvature aberration correction of a lens employing a cylindrically curved complementary metal-oxide–semiconductor (CMOS) image sensor without using multiple lenses. By employing a silicon-on-insulator (SOI) structure and applying etching using xenon fluoride ( ${\mathrm {XeF}}_{{2}})$ , we fabricated an extremely thin CMOS image sensor with an 11- $\mu $ m thickness without causing damage to the CMOS circuitry. Because of the structural characteristics of SOI, i.e., extremely small thickness and high SiO2 content, the fabricated CMOS image sensor is flexible and does not break easily even when curved. The device was curved on a concave surface, fixed to a cylindrical pedestal, and mounted on a package using wire bonding to implement a cylindrically curved CMOS image sensor with a curvature radius of 20 mm. Using the fabricated CMOS image sensor, we successfully captured video images ( $320\times 240$ pixels). A comparison between these images and those obtained from a flat CMOS image sensor showed that blurring at the lateral periphery of the images can be reduced using a single lens by curving the CMOS image sensor.
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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