全硅高精度MEMS加速度计寄生电容减小研究

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kunwei Zhao;Tianyou Chen;Lujia Yang;Wenjie Wu;Chenyuan Hu;Huafeng Liu;Ji Fan
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引用次数: 0

摘要

寄生电容是提高高精度电容式MEMS加速度计性能的一个关键挑战,特别是在灵敏度增强和自噪声最小化方面。对于夹层结构的MEMS加速度计,通常采用玻璃顶盖来减小寄生电容。然而,考虑到三维集成的要求,全硅结构更适合CMOS-MEMS集成。介绍了一种基于低阻硅衬底的悬浮电极MEMS加速度计。通过最小化拾取电极和硅衬底之间的重叠面积,寄生电容显着降低。此外,驱动电极和衬底之间的相对运动感应电容变化被接地电极屏蔽,进一步减轻了寄生电容对灵敏度的影响。实验结果表明,寄生电容从850 pF降低到68 pF,比例因子达到971 V/g,提高了近4.4倍。同时,通过降低MEMS加速度计谐振频率,自噪声最终达到0.9 ng/Hz1/2,近似等于器件的热力学噪声。这些结果验证了该方法的有效性,为实现高性能MEMS加速度计设计中的低寄生电容提供了一种解决方案。(2025 - 0025)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on Parasitic Capacitance Reduction in All-Silicon High-Precision MEMS Accelerometers
Parasitic capacitances pose a critical challenge for high-precision capacitive MEMS accelerometer performance improvement, particularly for the sensitivity enhancement and self-noise minimization. For the sandwich structure MEMS accelerometer, glass top cap is commonly employed to reduce parasitic capacitances. However, considering the requirement for three-dimensional integration, an all-silicon structure is more appropriate for CMOS-MEMS integration. This study introduces a MEMS accelerometer with suspended electrodes based on low-resistivity silicon substrate. By minimizing the overlap area between the pickup electrode and the silicon substrate, the parasite capacitances are significantly reduced. Additionally, the relative motion induced capacitance change between the drive electrode and the substrate is shielded by the grounding electrode, which further mitigates the effect of parasitic capacitance on sensitivity. Experimental results demonstrate that parasitic capacitances decrease from 850 pF to 68 pF. The scale factor reaches 971 V/g, making almost 4.4 times improvement. Meanwhile, by decreasing the MEMS accelerometer resonant frequency, the self-noise finally reaches 0.9 ng/Hz1/2, which is approximately equivalent to the thermodynamic noise of the device. These results validate the effectiveness of the proposed method, providing a solution for achieving low-parasitic capacitance in high-performance MEMS accelerometer design. [2025-0025]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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