采用保护性包膜的新型直接热轧工艺可实现AA3105铝片的可持续回收

IF 2 Q3 ENGINEERING, MANUFACTURING
M. El Mehtedi, M. Carta, P. Buonadonna
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引用次数: 0

摘要

本研究探索了一种新的AA3105铝芯片回收工艺,该工艺采用了AA1050铝外壳,在不影响芯片粘合的情况下,方便了润滑剂的使用,提高了表面质量。该工艺在540°C下进行,提高了微结构均匀性、机械性能和表面光洁度,解决了传统回收方法相关的关键挑战。利用光学显微镜和扫描电镜进行的显微组织分析证实了晶片的有效固结,缺陷最小,沿轧制方向排列的晶粒组织拉长。拉伸试验表明,该材料的屈服强度为99 MPa,极限抗拉强度为139 MPa,断裂伸长率为16.7%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel direct hot rolling process for sustainable recycling of AA3105 aluminum chips using a protective envelopment
This study explores a novel recycling process for AA3105 aluminum chips, incorporating an AA1050 aluminum envelope to facilitate the use of lubricants and improve surface quality without compromising chip bonding. The process, conducted at 540 °C, enhances microstructural uniformity, mechanical properties, and surface finish, addressing key challenges associated with traditional recycling methods. Microstructural analysis using optical microscopy and SEM confirmed effective chip consolidation, with minimal defects and elongated grain structures aligned along the rolling direction. Tensile testing revealed enhanced mechanical properties with a yield strength of 99 MPa, ultimate tensile strength of 139 MPa, and elongation at break of 16.7 %.
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来源期刊
Manufacturing Letters
Manufacturing Letters Engineering-Industrial and Manufacturing Engineering
CiteScore
4.20
自引率
5.10%
发文量
192
审稿时长
60 days
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