一种增强芯片散热性能的仿生微通道散热器。

IF 3.4 3区 医学 Q1 ENGINEERING, MULTIDISCIPLINARY
Kaichen Wang, Yan Shi, Junjie Chen, Yuchi Dai
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引用次数: 0

摘要

人工智能的快速发展不断增加对高计算能力的需求,导致芯片功耗和发热量大幅上升。因此,高效的热管理变得至关重要。受鲨鱼皮肤上的类placoid鳞片的启发,我们设计了一种仿生微通道散热器,通过在内部通道表面引入仿生结构来增强散热。通过数值模拟研究了不同结构构型下的热行为。结果表明:平面结构的排列、数量和倾角通过改变流态、扩大换热面积和改变热边界层等方式显著影响换热;值得注意的是,在流速为2 m/s时,0°和17°倾角的冷却性能差异显著。此外,在不同流速下,不同数量的类placoid结构的影响表现出一致的趋势。这些发现表明,仿生表面结构可以有效地改善微通道散热器的热性能,为高性能芯片冷却提供了一种有前途的策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Biomimetic Microchannel Heat Sink for Enhanced Thermal Performance in Chip Cooling.

The rapid advancement of artificial intelligence continuously increases the demand for high computing power, leading to substantial rises in chip power consumption and heat generation. As a result, efficient thermal management has become essential. Inspired by the placoid scales on shark skin, we designed a bionic microchannel heat sink by introducing biomimetic structures on the inner channel surfaces to enhance heat dissipation. Numerical simulations are performed to investigate thermal behavior under different structural configurations. The results show that the arrangement, number, and inclination angle of the placoid structures significantly influence heat transfer by modifying flow patterns, enlarging the heat transfer area, and altering the thermal boundary layer. Notably, at a flow velocity of 2 m/s, the cooling performance differs significantly between inclination angles of 0° and 17°. Moreover, the influence of different quantities of placoid structures shows a consistent trend across various flow rates. These findings demonstrate that bionic surface structures can effectively improve the thermal performance of microchannel heat sinks, offering a promising strategy for high-performance chip cooling.

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来源期刊
Biomimetics
Biomimetics Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
3.50
自引率
11.10%
发文量
189
审稿时长
11 weeks
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