铝合金原位TEM加热研究中样品制备的优化

IF 2.2 3区 工程技术 Q1 MICROSCOPY
Longhui Chen , Chunhui Liu , Jianshi Yang , Peipei Ma , Jun He
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引用次数: 0

摘要

铝铜锂(Al-Cu-Li)合金是航空航天领域的关键结构材料。其力学性能与时效过程中T1相的动态演化密切相关。为了准确捕捉这一动态过程,采用原位透射电子显微镜(TEM)结合微机电系统(MEMS)加热芯片对Al-Cu-Li合金中T1析出行为进行了实时观察。所有实验样品在510°C下溶液处理30 min,外部水淬火,然后在MEMS加热芯片上以1 °C/s的加热速率加热到180°C。本研究提出了一种改进的样品制备和转移方案,以减轻Ga的渗透。采用高角度环形暗场扫描TEM (HAADF-STEM)和能量色散x射线能谱(EDS)分析了制备方法、转移技术和样品厚度(80-300 nm)对镓(Ga)和铂(Pt)污染和沉淀行为的影响。结果表明,以~ 10 nm晶内颗粒和晶界富集形式存在的Ga偏析显著地扭曲了T1相的本征析出。而在3 kV的加速电压下,将外传递法与低能离子铣削相结合,可以有效抑制Ga/Pt污染。此外,样品厚度严重影响Al-Cu-Li合金的析出动力学:低于100 nm的样品表现出表面驱动的T1析出物异常粗化,而超过250 nm的样品由于有限的电子透明度而导致成像分辨率降低。150-200 nm的厚度范围最佳地平衡了分辨率保真度与代表性降水动力学。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimizing sample preparation for In situ TEM heating studies of aluminum alloys
Aluminum-copper-lithium (Al-Cu-Li) alloy is a key structural material in the aerospace field. Its mechanical properties are closely related to the dynamic evolution of T1 phase during the aging process. To accurately capture this dynamic process, the in situ transmission electron microscope (TEM) combined with the microelectromechanical system (MEMS) heating chip was used to observe the T1 precipitation behavior in an Al-Cu-Li alloy in real time. All experimental samples were solution treated at 510 °C for 30 min and water quenched externally, and then heated to 180 °C on a MEMS heater chip at a heating rate of 1 °C/s. This study presents an improved sample preparation and transfer protocol to mitigate Ga infiltration. High-angle annular dark-field scanning TEM (HAADF-STEM) and energy-dispersive X-ray spectroscopy (EDS) were used to evaluate the effects of preparation methods, transfer techniques, and sample thickness (80–300 nm) on gallium (Ga) and platinum (Pt) contamination and precipitation behavior. The results show that Ga segregation, in the form of ∼10 nm intragranular particles and grain boundary enrichment, significantly distorts the intrinsic precipitation of T1 phases. However, combining an external transfer method with low-energy ion milling at an accelerating voltage of 3 kV effectively suppresses Ga/Pt contamination. Furthermore, sample thickness critically influences precipitation kinetics in Al-Cu-Li alloys: sub-100 nm samples exhibit surface-driven abnormal coarsening of T1 precipitates, while samples exceeding 250 nm suffer from reduced imaging resolution due to limited electron transparency. A thickness range of 150–200 nm optimally balances resolution fidelity with representative precipitation dynamics.
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来源期刊
Micron
Micron 工程技术-显微镜技术
CiteScore
4.30
自引率
4.20%
发文量
100
审稿时长
31 days
期刊介绍: Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.
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