在超薄聚酰亚胺基板上使用表面能定向组装工艺制造高性能柔性电子器件（Small 29/2025）

IF 12.1 2区材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY

Small Pub Date : 2025-07-24 DOI:10.1002/smll.202570224

Zetong Li, Zhimin Chai, Guangji Wang, Jingwei Zhang, Tongqing Wang, Dewen Zhao, Ahmed A. Busnaina, Xinchun Lu

{"title":"在超薄聚酰亚胺基板上使用表面能定向组装工艺制造高性能柔性电子器件（Small 29/2025）","authors":"Zetong Li, Zhimin Chai, Guangji Wang, Jingwei Zhang, Tongqing Wang, Dewen Zhao, Ahmed A. Busnaina, Xinchun Lu","doi":"10.1002/smll.202570224","DOIUrl":null,"url":null,"abstract":"<p><b>Flexible Electronics</b></p><p>In article number 2409458, Zhimin Chai, Xinchun Lu, and co-workers report on constructing hydrophilic and hydrophobic patterned surfaces on polyimide (PI) substrates, addressing the problem that PI substrates are difficult to process into sufficiently hydrophobic. With the proposed pretreatment, a threefold improvement in active sites is achieved to ensure that PI could react adequately with the hydrophobic molecules. The pretreatment enables fabrication of all-solution-processed metal oxide electronics on PI substrates.\n\n <figure>\n <div><picture>\n <source></source></picture><p></p>\n </div>\n </figure></p>","PeriodicalId":228,"journal":{"name":"Small","volume":"21 29","pages":""},"PeriodicalIF":12.1000,"publicationDate":"2025-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/smll.202570224","citationCount":"0","resultStr":"{\"title\":\"High-Performance Flexible Electronics Fabricated Using a Surface Energy-Directed Assembly Process on Ultrathin Polyimide Substrates (Small 29/2025)\",\"authors\":\"Zetong Li, Zhimin Chai, Guangji Wang, Jingwei Zhang, Tongqing Wang, Dewen Zhao, Ahmed A. Busnaina, Xinchun Lu\",\"doi\":\"10.1002/smll.202570224\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><b>Flexible Electronics</b></p><p>In article number 2409458, Zhimin Chai, Xinchun Lu, and co-workers report on constructing hydrophilic and hydrophobic patterned surfaces on polyimide (PI) substrates, addressing the problem that PI substrates are difficult to process into sufficiently hydrophobic. With the proposed pretreatment, a threefold improvement in active sites is achieved to ensure that PI could react adequately with the hydrophobic molecules. The pretreatment enables fabrication of all-solution-processed metal oxide electronics on PI substrates.\\n\\n <figure>\\n <div><picture>\\n <source></source></picture><p></p>\\n </div>\\n </figure></p>\",\"PeriodicalId\":228,\"journal\":{\"name\":\"Small\",\"volume\":\"21 29\",\"pages\":\"\"},\"PeriodicalIF\":12.1000,\"publicationDate\":\"2025-07-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/smll.202570224\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Small\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/smll.202570224\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Small","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/smll.202570224","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

摘要

【柔性电子学】在文章编号2409458中，柴志敏，卢鑫春等报道了在聚酰亚胺（PI）衬底上构建亲疏水和疏水图案表面，解决了PI衬底难以加工成足够疏水的问题。通过所提出的预处理，活性位点得到了三倍的改善，以确保PI能够与疏水分子充分反应。预处理可以在PI基板上制造全溶液处理的金属氧化物电子器件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

High-Performance Flexible Electronics Fabricated Using a Surface Energy-Directed Assembly Process on Ultrathin Polyimide Substrates (Small 29/2025)

查看原文本刊更多论文

High-Performance Flexible Electronics Fabricated Using a Surface Energy-Directed Assembly Process on Ultrathin Polyimide Substrates (Small 29/2025)

Flexible Electronics

In article number 2409458, Zhimin Chai, Xinchun Lu, and co-workers report on constructing hydrophilic and hydrophobic patterned surfaces on polyimide (PI) substrates, addressing the problem that PI substrates are difficult to process into sufficiently hydrophobic. With the proposed pretreatment, a threefold improvement in active sites is achieved to ensure that PI could react adequately with the hydrophobic molecules. The pretreatment enables fabrication of all-solution-processed metal oxide electronics on PI substrates.

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来源期刊

Small 工程技术-材料科学：综合

CiteScore

17.70

自引率

3.80%

发文量

1830

审稿时长

2.1 months

期刊介绍： Small serves as an exceptional platform for both experimental and theoretical studies in fundamental and applied interdisciplinary research at the nano- and microscale. The journal offers a compelling mix of peer-reviewed Research Articles, Reviews, Perspectives, and Comments. With a remarkable 2022 Journal Impact Factor of 13.3 (Journal Citation Reports from Clarivate Analytics, 2023), Small remains among the top multidisciplinary journals, covering a wide range of topics at the interface of materials science, chemistry, physics, engineering, medicine, and biology. Small's readership includes biochemists, biologists, biomedical scientists, chemists, engineers, information technologists, materials scientists, physicists, and theoreticians alike.