不同金属接触密度下杂化界面粘接强度的定量评价

IF 3.1 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronic Engineering Pub Date : 2025-07-23 DOI:10.1016/j.mee.2025.112384

Kris Vanstreels, Oguzhan Orkut Okudur, Mario Gonzalez, Eric Beyne

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引用次数: 0

摘要

本工作系统地研究了金属接触密度和间距尺寸对杂化键合界面结合强度的影响，采用基于能量的纳米压痕方法来量化界面结合强度。结果表明，金属的存在增强了杂化键合界面的结合强度，且随着节距尺寸的减小，这种效应越来越明显。这种增强归因于金属/金属界面在界面断裂过程中作为裂纹止裂点的作用。这项工作的发现为优化先进互连技术中的混合键合设计提供了重要的见解。

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Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density

This work systematically investigates the influence of metal contact density and pitch size on the adhesion strength of hybrid bonded interfaces using an energy-based nanoindentation methodology to quantify interfacial bond strength. Results show that the presence of metal at the bonding interface enhances adhesion strength of hybrid bonded interfaces, with the effect becoming increasingly pronounced for lower pitch sizes. This enhancement is attributed to the role of metal/metal interfaces as crack-arresting sites during interfacial fracture. The findings in this work provide critical insights for optimizing hybrid bonding designs in advanced interconnect technologies.

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来源期刊

Microelectronic Engineering 工程技术-工程：电子与电气

CiteScore

5.30

自引率

4.30%

发文量

131

审稿时长

29 days

期刊介绍： Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.