{"title":"结合超疏水表面的柔性热差压传感器阵列,用于飞行参数估计。","authors":"Xin Ke, Yu Gao, Zheng Gong, Yunfan Li, Zihao Dong, Bowei Wan, Yurun Guo, Yonggang Jiang","doi":"10.1038/s41378-025-00942-2","DOIUrl":null,"url":null,"abstract":"<p><p>Distributed pressure sensor array is a promising approach for the estimation of flight parameters for small unmanned aerial vehicles. Current flexible pressure sensor arrays are conventionally subjected to limited sensor resolution, poor bending flexibility, and inadequate packaging protection, resulting in insufficient precision for flight parameter estimation. Here we present a high-resolution differential pressure sensor array using a calorimetric measurement method and a multilayer polyimide bonding technique. The proposed differential pressure sensor array reaches a detection limit of 36.5 mPa over a range of 500 Pa and shows high repeatability when attached to varying curved surfaces. In addition, a superhydrophobic packaging is integrated into the sensor fabrication process, endowing it with waterproof capability. Utilizing a multilayer perceptron neural network, we demonstrated the function of the sensor array in estimating airspeeds and angle of attacks, achieving average solving errors of 0.15 m/s and 0.37°, respectively.</p>","PeriodicalId":18560,"journal":{"name":"Microsystems & Nanoengineering","volume":"11 1","pages":"146"},"PeriodicalIF":9.9000,"publicationDate":"2025-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12280219/pdf/","citationCount":"0","resultStr":"{\"title\":\"Flexible calorimetric differential pressure sensor array integrated with a superhydrophobic surface for flight parameter estimation.\",\"authors\":\"Xin Ke, Yu Gao, Zheng Gong, Yunfan Li, Zihao Dong, Bowei Wan, Yurun Guo, Yonggang Jiang\",\"doi\":\"10.1038/s41378-025-00942-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><p>Distributed pressure sensor array is a promising approach for the estimation of flight parameters for small unmanned aerial vehicles. Current flexible pressure sensor arrays are conventionally subjected to limited sensor resolution, poor bending flexibility, and inadequate packaging protection, resulting in insufficient precision for flight parameter estimation. Here we present a high-resolution differential pressure sensor array using a calorimetric measurement method and a multilayer polyimide bonding technique. The proposed differential pressure sensor array reaches a detection limit of 36.5 mPa over a range of 500 Pa and shows high repeatability when attached to varying curved surfaces. In addition, a superhydrophobic packaging is integrated into the sensor fabrication process, endowing it with waterproof capability. Utilizing a multilayer perceptron neural network, we demonstrated the function of the sensor array in estimating airspeeds and angle of attacks, achieving average solving errors of 0.15 m/s and 0.37°, respectively.</p>\",\"PeriodicalId\":18560,\"journal\":{\"name\":\"Microsystems & Nanoengineering\",\"volume\":\"11 1\",\"pages\":\"146\"},\"PeriodicalIF\":9.9000,\"publicationDate\":\"2025-07-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12280219/pdf/\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microsystems & Nanoengineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1038/s41378-025-00942-2\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"INSTRUMENTS & INSTRUMENTATION\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystems & Nanoengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1038/s41378-025-00942-2","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
Flexible calorimetric differential pressure sensor array integrated with a superhydrophobic surface for flight parameter estimation.
Distributed pressure sensor array is a promising approach for the estimation of flight parameters for small unmanned aerial vehicles. Current flexible pressure sensor arrays are conventionally subjected to limited sensor resolution, poor bending flexibility, and inadequate packaging protection, resulting in insufficient precision for flight parameter estimation. Here we present a high-resolution differential pressure sensor array using a calorimetric measurement method and a multilayer polyimide bonding technique. The proposed differential pressure sensor array reaches a detection limit of 36.5 mPa over a range of 500 Pa and shows high repeatability when attached to varying curved surfaces. In addition, a superhydrophobic packaging is integrated into the sensor fabrication process, endowing it with waterproof capability. Utilizing a multilayer perceptron neural network, we demonstrated the function of the sensor array in estimating airspeeds and angle of attacks, achieving average solving errors of 0.15 m/s and 0.37°, respectively.
期刊介绍:
Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.