Siddhesh S. Kulkarni , Israr Ud Din , Yarjan Abdul Samad , Kamran A. Khan
{"title":"用于可折叠电子应用的高温可拉伸薄膜的热粘弹性表征和建模","authors":"Siddhesh S. Kulkarni , Israr Ud Din , Yarjan Abdul Samad , Kamran A. Khan","doi":"10.1016/j.ijengsci.2025.104352","DOIUrl":null,"url":null,"abstract":"<div><div>Foldable electronics with high thermal stability, flexibility and stretchability enable emerging applications such as soft robotics, electronic skins, human–machine interfaces, and foldable displays. This study presents a detailed thermo-mechanical characterization and modeling of Beyolex™, a recently developed non-silicone-based thermoset polymeric substrate used in stretchable electronics. During operation, Beyolex™ undergoes diverse loading histories, motivating a comprehensive experimental program. We performed tensile tests at various loading rates, along with stress relaxation, creep, and cyclic loading tests. To replicate in-service thermal conditions, experiments were conducted at 25 °C, 75 °C, 90 °C, 125 °C, and 150 °C, covering the full operational temperature range of the material. A finite viscoelasticity-based integral model was developed, formulated from the material’s equilibrium (long-term stress) response. The model was further enhanced to capture thermal effects and stress softening behavior. An iterative root-finding algorithm was developed to simulate the model’s response to both displacement-controlled and force-controlled loading conditions. Finally, a calibration methodology was implemented to fit the model parameters and assess its performance. Simulated results under various loading histories showed reasonable agreement with experimental data, supporting the model’s capability to represent Beyolex™’s thermo-mechanical behavior<em>.</em></div></div>","PeriodicalId":14053,"journal":{"name":"International Journal of Engineering Science","volume":"216 ","pages":"Article 104352"},"PeriodicalIF":5.7000,"publicationDate":"2025-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermo-viscoelastic characterization and modeling of a high-temperature stretchable film for foldable electronics applications\",\"authors\":\"Siddhesh S. Kulkarni , Israr Ud Din , Yarjan Abdul Samad , Kamran A. Khan\",\"doi\":\"10.1016/j.ijengsci.2025.104352\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Foldable electronics with high thermal stability, flexibility and stretchability enable emerging applications such as soft robotics, electronic skins, human–machine interfaces, and foldable displays. This study presents a detailed thermo-mechanical characterization and modeling of Beyolex™, a recently developed non-silicone-based thermoset polymeric substrate used in stretchable electronics. During operation, Beyolex™ undergoes diverse loading histories, motivating a comprehensive experimental program. We performed tensile tests at various loading rates, along with stress relaxation, creep, and cyclic loading tests. To replicate in-service thermal conditions, experiments were conducted at 25 °C, 75 °C, 90 °C, 125 °C, and 150 °C, covering the full operational temperature range of the material. A finite viscoelasticity-based integral model was developed, formulated from the material’s equilibrium (long-term stress) response. The model was further enhanced to capture thermal effects and stress softening behavior. An iterative root-finding algorithm was developed to simulate the model’s response to both displacement-controlled and force-controlled loading conditions. Finally, a calibration methodology was implemented to fit the model parameters and assess its performance. Simulated results under various loading histories showed reasonable agreement with experimental data, supporting the model’s capability to represent Beyolex™’s thermo-mechanical behavior<em>.</em></div></div>\",\"PeriodicalId\":14053,\"journal\":{\"name\":\"International Journal of Engineering Science\",\"volume\":\"216 \",\"pages\":\"Article 104352\"},\"PeriodicalIF\":5.7000,\"publicationDate\":\"2025-07-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Engineering Science\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0020722525001399\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Engineering Science","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0020722525001399","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
Thermo-viscoelastic characterization and modeling of a high-temperature stretchable film for foldable electronics applications
Foldable electronics with high thermal stability, flexibility and stretchability enable emerging applications such as soft robotics, electronic skins, human–machine interfaces, and foldable displays. This study presents a detailed thermo-mechanical characterization and modeling of Beyolex™, a recently developed non-silicone-based thermoset polymeric substrate used in stretchable electronics. During operation, Beyolex™ undergoes diverse loading histories, motivating a comprehensive experimental program. We performed tensile tests at various loading rates, along with stress relaxation, creep, and cyclic loading tests. To replicate in-service thermal conditions, experiments were conducted at 25 °C, 75 °C, 90 °C, 125 °C, and 150 °C, covering the full operational temperature range of the material. A finite viscoelasticity-based integral model was developed, formulated from the material’s equilibrium (long-term stress) response. The model was further enhanced to capture thermal effects and stress softening behavior. An iterative root-finding algorithm was developed to simulate the model’s response to both displacement-controlled and force-controlled loading conditions. Finally, a calibration methodology was implemented to fit the model parameters and assess its performance. Simulated results under various loading histories showed reasonable agreement with experimental data, supporting the model’s capability to represent Beyolex™’s thermo-mechanical behavior.
期刊介绍:
The International Journal of Engineering Science is not limited to a specific aspect of science and engineering but is instead devoted to a wide range of subfields in the engineering sciences. While it encourages a broad spectrum of contribution in the engineering sciences, its core interest lies in issues concerning material modeling and response. Articles of interdisciplinary nature are particularly welcome.
The primary goal of the new editors is to maintain high quality of publications. There will be a commitment to expediting the time taken for the publication of the papers. The articles that are sent for reviews will have names of the authors deleted with a view towards enhancing the objectivity and fairness of the review process.
Articles that are devoted to the purely mathematical aspects without a discussion of the physical implications of the results or the consideration of specific examples are discouraged. Articles concerning material science should not be limited merely to a description and recording of observations but should contain theoretical or quantitative discussion of the results.