Alexander K. Bailey;Willsen Wijaya;Seho Kim;Jerry Sun;Tom Allen;Grant A. Covic
{"title":"电感输电中封装对铁氧体铁芯损耗的影响","authors":"Alexander K. Bailey;Willsen Wijaya;Seho Kim;Jerry Sun;Tom Allen;Grant A. Covic","doi":"10.1109/OJPEL.2025.3584753","DOIUrl":null,"url":null,"abstract":"Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for <inline-formula><tex-math>$\\mathrm{2.5}$</tex-math></inline-formula> <inline-formula><tex-math>$\\mathrm{kW}$</tex-math></inline-formula> is built and tested, and the core loss of the ferrite tiles increases by <inline-formula><tex-math>$\\mathrm{121}$</tex-math></inline-formula>% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within <inline-formula><tex-math>$\\mathrm{7.3}$</tex-math></inline-formula>% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad.","PeriodicalId":93182,"journal":{"name":"IEEE open journal of power electronics","volume":"6 ","pages":"1215-1224"},"PeriodicalIF":3.9000,"publicationDate":"2025-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11060834","citationCount":"0","resultStr":"{\"title\":\"Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer\",\"authors\":\"Alexander K. Bailey;Willsen Wijaya;Seho Kim;Jerry Sun;Tom Allen;Grant A. Covic\",\"doi\":\"10.1109/OJPEL.2025.3584753\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for <inline-formula><tex-math>$\\\\mathrm{2.5}$</tex-math></inline-formula> <inline-formula><tex-math>$\\\\mathrm{kW}$</tex-math></inline-formula> is built and tested, and the core loss of the ferrite tiles increases by <inline-formula><tex-math>$\\\\mathrm{121}$</tex-math></inline-formula>% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within <inline-formula><tex-math>$\\\\mathrm{7.3}$</tex-math></inline-formula>% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad.\",\"PeriodicalId\":93182,\"journal\":{\"name\":\"IEEE open journal of power electronics\",\"volume\":\"6 \",\"pages\":\"1215-1224\"},\"PeriodicalIF\":3.9000,\"publicationDate\":\"2025-06-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11060834\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE open journal of power electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11060834/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE open journal of power electronics","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/11060834/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer
Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for $\mathrm{2.5}$$\mathrm{kW}$ is built and tested, and the core loss of the ferrite tiles increases by $\mathrm{121}$% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within $\mathrm{7.3}$% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad.