电感输电中封装对铁氧体铁芯损耗的影响

IF 3.9 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Alexander K. Bailey;Willsen Wijaya;Seho Kim;Jerry Sun;Tom Allen;Grant A. Covic
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引用次数: 0

摘要

电感功率传输(IPT)磁体通常被封装在封装材料中以提高热性能。封装和磁芯材料的不匹配热膨胀会产生残余的机械应力,从而永久性地降低Mn-Zn铁氧体磁芯层的磁性能。为$ $\ mathm {2.5}$ $ $\ mathm {kW}$设计了一种封装的小型双d IPT垫,并进行了测试,在使用聚氨酯基材料封装后,铁氧体瓦的核心损耗增加了$ $\ mathm{121}$%。采用有限元方法预测了封装后IPT焊盘的堆芯损耗变化,所得方法在$\mathrm{7.3}$%范围内匹配。提出了三种方法来减轻损耗的增加,并在铁氧体环面上进行了实验验证。这些结果表明,封装材料的选择对IPT衬垫的热性能、结构性能和电磁性能有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer
Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for $\mathrm{2.5}$ $\mathrm{kW}$ is built and tested, and the core loss of the ferrite tiles increases by $\mathrm{121}$% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within $\mathrm{7.3}$% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad.
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来源期刊
CiteScore
8.60
自引率
0.00%
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审稿时长
8 weeks
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