具有嵌入微尺度电磁功能导电特征的三维非均质结构的多材料打印

IF 11.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Kun Yu , Wenyou Zhang , Jiakun Feng , Junyu Yue , Yi Ding , Qingxuan Liang , Yi Cao , Dichen Li , Jiankang He
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引用次数: 0

摘要

近年来,多材料打印作为一种集成制造具有微尺度共形/嵌入式电子器件的三维非均匀结构的有效策略,在天线或超表面领域受到了广泛的关注。然而,作为应用最广泛的多材料打印工艺之一,熔融长丝制造(FFF)通常存在表面形貌不佳的问题,这对随后沉积具有微分辨率和稳定导电性的导电特征提出了重大挑战。在这里,我们提出了一种新的多材料打印策略,将同轴电流体动力(CEHD)打印和FFF相结合,用于一步制造具有共形或嵌入式微电子的三维非均质结构。研究发现,在CEHD过程中,外层聚酰亚胺(PI)层可以局部光滑fff打印的PEEK表面,使其具有不同的粗糙度,并且可以直接沉积具有稳定导电性的微尺度核壳导电特征。值得注意的是,在粗糙度为23.57 ± 6.24 μm的fff打印表面上,银的最小导电线宽为42.10 ± 3.45 μm,电导率为(0.32 ± 0.01)× 107 S/m。所提出的策略在不同的衬底材料和几何形状上具有广泛的适用性,并且在不同的机械/物理条件下具有很强的界面结合强度和优异的电稳定性。更重要的是,所提出的多材料打印技术在集成制造具有内置微电子的三维非均质结构方面具有很大的灵活性。嵌入式微电子的模式表现出特定层的变化,这表明了一种创新的策略来调制所产生的异质结构的电磁功能。我们设想,所提出的多材料打印技术提供了一种独特的能力,可以集成制造具有设计电磁功能的机械/电气结构,从而应用于弯曲共形天线和电磁屏蔽设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multi-material printing of 3D heterogeneous structures with embedded microscale conductive features for electromagnetic function
Multi-material printing has recently gained extensive attention as an efficient strategy for the integrated fabrication of 3D heterogeneous structures with microscale conformal/embedded electronics in the field of antennas or metasurface. However, as one of the most popularly utilized multi-material printing processes, fused filament fabrication (FFF) commonly suffers from poor surface morphology, which poses a significant challenge for the subsequent deposition of conductive features with micro-resolution and stable conductivity. Here, we propose a novel multi-material printing strategy by combining coaxial electrohydrodynamic (CEHD) printing and FFF for the one-step fabrication of 3D heterogeneous structures with conformal or embedded microelectronics. It is found that the outer polyimide (PI) layer applied during the CEHD process can locally smooth the FFF-printed PEEK surfaces with varying roughness and enables the direct deposition of microscale core-shell conductive features with stable conductivity. Remarkably, the smallest conductive linewidth of Ag that can be achieved on an FFF-printed surface with a roughness of 23.57 ± 6.24 μm is 42.10 ± 3.45 μm, showing a conductivity of (0.32 ± 0.01) × 107 S/m. The proposed strategy demonstrates wide applicability across different substrate materials and geometries, and exhibits strong interfacial bonding strength and excellent electrical stability under different mechanical/physical conditions. More importantly, the presented multi-material printing technique offers great flexibility in integrally fabricating 3D heterogeneous structures with built-in microelectronics. The patterns of the embedded microelectronics exhibit a layer-specific variation, which demonstrates an innovative strategy to modulate the electromagnetic functionalities of the resultant heterogeneous structures. We envision that the proposed multi-material printing technique offers a unique capability to integrally fabricate mechanical/electrical structures with designed electromagnetic functionalities, enabling applications in curved conformal antennas and electromagnetic shielding devices.
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来源期刊
Additive manufacturing
Additive manufacturing Materials Science-General Materials Science
CiteScore
19.80
自引率
12.70%
发文量
648
审稿时长
35 days
期刊介绍: Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects. The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.
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