基于频域热反射和深度神经网络特征重构的宽场键合质量评价。接口13/2025)

IF 4.3 3区材料科学 Q2 CHEMISTRY, MULTIDISCIPLINARY

Advanced Materials Interfaces Pub Date : 2025-07-17 DOI:10.1002/admi.70057

Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates

{"title":"基于频域热反射和深度神经网络特征重构的宽场键合质量评价。接口13/2025)","authors":"Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates","doi":"10.1002/admi.70057","DOIUrl":null,"url":null,"abstract":"Wide-Field Frequency Domain ThermoreflectanceWide-field (≥1 mm2) frequency-domain thermoreflectance hyperspectral imaging is used to image subsurface indium bump bonds 50 μm below the surface. Thermal analysis enables evaluation of bump quality in a surrogate heterogeneously integrated microelectronic. More details can be found in article 2401039 by Amun Jarzembski, Fabio Semperlotti, and co-workers.\n\n <figure>\n <div><picture>\n <source></source></picture>\n </div>\n </figure>","PeriodicalId":115,"journal":{"name":"Advanced Materials Interfaces","volume":"12 13","pages":""},"PeriodicalIF":4.3000,"publicationDate":"2025-07-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/admi.70057","citationCount":"0","resultStr":"{\"title\":\"Wide-Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction (Adv. Mater. Interfaces 13/2025)\",\"authors\":\"Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates\",\"doi\":\"10.1002/admi.70057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wide-Field Frequency Domain ThermoreflectanceWide-field (≥1 mm2) frequency-domain thermoreflectance hyperspectral imaging is used to image subsurface indium bump bonds 50 μm below the surface. Thermal analysis enables evaluation of bump quality in a surrogate heterogeneously integrated microelectronic. More details can be found in article 2401039 by Amun Jarzembski, Fabio Semperlotti, and co-workers.\\n\\n <figure>\\n <div><picture>\\n <source></source></picture>\\n </div>\\n </figure>\",\"PeriodicalId\":115,\"journal\":{\"name\":\"Advanced Materials Interfaces\",\"volume\":\"12 13\",\"pages\":\"\"},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2025-07-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/admi.70057\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Materials Interfaces\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/admi.70057\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Materials Interfaces","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/admi.70057","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

摘要

宽场频域热反射宽场（≥1 mm2）频域热反射高光谱成像用于对表面以下50 μm的地下铟凹凸键进行成像。热分析可以评估异质集成微电子器件的碰撞质量。更多细节可以在Amun Jarzembski， Fabio Semperlotti及其同事的文章2401039中找到。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Wide-Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction (Adv. Mater. Interfaces 13/2025)

查看原文本刊更多论文

Wide-Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction (Adv. Mater. Interfaces 13/2025)

Wide-Field Frequency Domain Thermoreflectance

Wide-field (≥1 mm²) frequency-domain thermoreflectance hyperspectral imaging is used to image subsurface indium bump bonds 50 μm below the surface. Thermal analysis enables evaluation of bump quality in a surrogate heterogeneously integrated microelectronic. More details can be found in article 2401039 by Amun Jarzembski, Fabio Semperlotti, and co-workers.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Advanced Materials Interfaces CHEMISTRY, MULTIDISCIPLINARY-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

8.40

自引率

5.60%

发文量

1174

审稿时长

1.3 months

期刊介绍： Advanced Materials Interfaces publishes top-level research on interface technologies and effects. Considering any interface formed between solids, liquids, and gases, the journal ensures an interdisciplinary blend of physics, chemistry, materials science, and life sciences. Advanced Materials Interfaces was launched in 2014 and received an Impact Factor of 4.834 in 2018. The scope of Advanced Materials Interfaces is dedicated to interfaces and surfaces that play an essential role in virtually all materials and devices. Physics, chemistry, materials science and life sciences blend to encourage new, cross-pollinating ideas, which will drive forward our understanding of the processes at the interface. Advanced Materials Interfaces covers all topics in interface-related research: Oil / water separation, Applications of nanostructured materials, 2D materials and heterostructures, Surfaces and interfaces in organic electronic devices, Catalysis and membranes, Self-assembly and nanopatterned surfaces, Composite and coating materials, Biointerfaces for technical and medical applications. Advanced Materials Interfaces provides a forum for topics on surface and interface science with a wide choice of formats: Reviews, Full Papers, and Communications, as well as Progress Reports and Research News.