Cu - TCPP原位硫化建立S - Scheme p - n结以提高CO2光还原和灭菌的光催化活性

IF 12.1 2区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Small Pub Date : 2025-07-15 DOI:10.1002/smll.202506146
Rui-Qiang Zhou, Ke-Tong Zhang, Na Zhang, Jian-Yong Zhang, Jing Guo, Yong-Zheng Fang
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引用次数: 0

摘要

在这项工作中,通过Cu - TCPP的原位界面硫化,设计和制造了一个S型p - n结。由于原位衍生cu的结合,光吸收扩展到全太阳光谱,具有预期的热效应和指数级提高的电导率。共共享的Cu原子激发了密切的原子级接触和强电子合作,形成了高速电子/热传递通道。形成的O─Cu─S键使Cu - TCPP界面处的费米能级上移,并诱导了一个额外的电子萃取驱动力,抑制了光生载流子的重组。cu‐3的CO产率可达693.51µmol g−¹h−¹,选择性提高了99.23%。考虑到增强的光热转化和氧化能力,在模拟太阳光照下也可以根除99.99%的金黄色葡萄球菌。超常规的自愈合和生物相容性在伤口治疗中得到了体现。这种高效率的光荷,加上高质量界面上的“温室”效应,刺激了其他类似材料组件的开发。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Building S-Scheme p-n Junction by the In Situ Sulfidation of Cu-TCPP Toward Boosted Photocatalytic Activity for CO2 Photoreduction and Sterilization

Building S-Scheme p-n Junction by the In Situ Sulfidation of Cu-TCPP Toward Boosted Photocatalytic Activity for CO2 Photoreduction and Sterilization

In this work, an S-type p-n junction is designed and fabricated by in situ interfacial sulfidation of Cu-TCPP. Due to the combination of in situ derived CuS, the light absorption expanded to the full-solar-light spectrum, with expected thermal effect and exponentially increased electrical conductivity. The co-shared Cu atoms inspired intimate atomic-level contact and strong electron cooperation to formulate the high-speed electron/heat transfer channel. The formed O─Cu─S bonds up-shifted the Fermi level at the interface of Cu-TCPP and induced an extra driven force for electron extraction, suppressing the recombination of photogenerated carriers. The CO product yield over CuS-3 can reach 693.51 µmol g¹ h¹ with the increased selectivity of 99.23%. Considering the enhanced photothermal conversion and oxidation capacity, it could also eradicate 99.99% of S. aureus under simulated solar light. The outperformed self-healing and bio-compatible property is undercovered in the wound treatment. This high-efficiency photocharges, coupled with the “greenhouse” effect at high-quality interface, has stimulated the exploitation of other similar material assemblies.

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来源期刊
Small
Small 工程技术-材料科学:综合
CiteScore
17.70
自引率
3.80%
发文量
1830
审稿时长
2.1 months
期刊介绍: Small serves as an exceptional platform for both experimental and theoretical studies in fundamental and applied interdisciplinary research at the nano- and microscale. The journal offers a compelling mix of peer-reviewed Research Articles, Reviews, Perspectives, and Comments. With a remarkable 2022 Journal Impact Factor of 13.3 (Journal Citation Reports from Clarivate Analytics, 2023), Small remains among the top multidisciplinary journals, covering a wide range of topics at the interface of materials science, chemistry, physics, engineering, medicine, and biology. Small's readership includes biochemists, biologists, biomedical scientists, chemists, engineers, information technologists, materials scientists, physicists, and theoreticians alike.
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