Synthesis and molecular dynamics investigation of Mg/SiCP composites with high thermal conductivity and low expansion

The critical challenge of chip thermal dissipation fundamentally constrains both power consumption and operational longevity, underscoring the imperative demand for advanced packaging materials exhibiting superior thermal conductivity coupled with ultralow thermal expansion. Magnesium-based packaging systems demonstrate considerable promise in this strategic domain; however, current research efforts remain notably sparse, particularly regarding SiC particulate (SiC_P)-reinforced magnesium matrix composites. In this investigation, we prepared SiC_P-reinforced magnesium matrix composites through optimized stir casting methodology and systematically investigated their thermophysical characteristics. Remarkably, the composite incorporating merely 25 vol.% SiC_P exhibited exceptional thermal performance metrics: a thermal conductivity of 178.5 W/(m·K) and a coefficient of thermal expansion as low as 16.8 × 10⁻⁶ K⁻¹. Furthermore, molecular dynamics simulations were employed to elucidate thermal transport mechanisms at Mg/SiC interfaces, revealing that chromium interlayer implementation substantially enhances interfacial thermal conductance compared to direct bonding configurations. This comprehensive study not only validates the efficacy of SiC_P reinforcement in optimizing magnesium matrix composites’ thermophysical properties but also establishes Mg/SiC_P composites as a cost-competitive solution for next-generation thermal management applications.