采用简单的硅烷化预处理，可有效抑制多层片式电感中镍镀层的横向生长

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-07-03 DOI:10.1016/j.matlet.2025.139042

Lixia Yang , Zhuocheng Wei , Jingjing Wu , Yuanqiang Xiao , Mingcan Cao , Qu-ao Li , Jun-e Qu , JunXia Wang

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引用次数: 0

摘要

多层片式电感（MLCI）铁氧体表面镍镀层的横向生长是桶状镀工艺中制备Ag/Ni/Sn终端电极的关键问题，特别是在高电流密度的酸性镀液中。为了抑制镍的横向生长，初步采用简单硅烷化预处理MLCI，研究了其抑制效果及其对电沉积行为和焊接性能的影响。将水解后的γ-GPS和BTSE选择性吸附在铁氧体表面，确定了最佳配方。工业现场实验证明，硅化后的横向生长比（Rlg）从41.29%大幅降低到0，镍镀层从1.4 μm增加到2.0 μm，焊接性能良好。

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A simple silanization pretreatment to effectively inhibit the lateral growth of nickel electrodeposits for multilayer chip inductors

The lateral growth of nickel electrodeposits on ferrite surfaces of multilayer chip inductors (MLCI) is a key problem for the preparation of Ag/Ni/Sn terminal electrode in barrel plating, especially in acidic bath under high current density. Simple silanization is tentatively used to the pretreatment of MLCI aiming at inhibiting the lateral growth of nickel, the inhibiting effect and its influence on the electrodeposition behavior and welding performance are investigated. The hydrolyzed γ-GPS and BTSE are selectively adsorbed on the ferrite surfaces, and the optimized formulation is determined. The industrial field experiments prove that the lateral growth ratio (R_lg) dramatically decreases from 41.29% to 0 after silanization, and that nickel electrodeposits increases from 1.4 to 2.0 μm with good welding performance.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive