用于片对片系统中高速数据处理的位串行计算机传输体系结构

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiaoshu Cheng, Siyi Pan, Yiwen Wang, Weiran Ding, Ping Li
{"title":"用于片对片系统中高速数据处理的位串行计算机传输体系结构","authors":"Xiaoshu Cheng,&nbsp;Siyi Pan,&nbsp;Yiwen Wang,&nbsp;Weiran Ding,&nbsp;Ping Li","doi":"10.1049/ell2.70352","DOIUrl":null,"url":null,"abstract":"<p>This brief proposes a bit-serial compute-transfer architecture tailored for high-speed data processing across chip-to-chip links. Our design merges computation and transmission at the physical layer via a voltage-mode logic (VML) interface, without intermediate packing or unpacking. In SMIC 0.13 µm CMOS, the architecture achieves 1 Gbps per channel at 1 GHz, delivering 0.625 GOPS to resource-constrained edge devices. While overall energy efficiency is lower than that of computing-only designs, the proposed structure excels in area, gate density, and scalability. This compute-transfer architecture reduces bandwidth bottlenecks and deserialization overhead in multi-chip systems, offering a modular building block for future neural network accelerators.</p>","PeriodicalId":11556,"journal":{"name":"Electronics Letters","volume":"61 1","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2025-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/ell2.70352","citationCount":"0","resultStr":"{\"title\":\"A Bit-Serial Compute-Transfer Architecture for High-Speed Data Processing in Chip-to-Chip Systems\",\"authors\":\"Xiaoshu Cheng,&nbsp;Siyi Pan,&nbsp;Yiwen Wang,&nbsp;Weiran Ding,&nbsp;Ping Li\",\"doi\":\"10.1049/ell2.70352\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>This brief proposes a bit-serial compute-transfer architecture tailored for high-speed data processing across chip-to-chip links. Our design merges computation and transmission at the physical layer via a voltage-mode logic (VML) interface, without intermediate packing or unpacking. In SMIC 0.13 µm CMOS, the architecture achieves 1 Gbps per channel at 1 GHz, delivering 0.625 GOPS to resource-constrained edge devices. While overall energy efficiency is lower than that of computing-only designs, the proposed structure excels in area, gate density, and scalability. This compute-transfer architecture reduces bandwidth bottlenecks and deserialization overhead in multi-chip systems, offering a modular building block for future neural network accelerators.</p>\",\"PeriodicalId\":11556,\"journal\":{\"name\":\"Electronics Letters\",\"volume\":\"61 1\",\"pages\":\"\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2025-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1049/ell2.70352\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronics Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1049/ell2.70352\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronics Letters","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/ell2.70352","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文提出了一种位串行计算机传输体系结构,用于跨芯片到芯片链路的高速数据处理。我们的设计通过电压模式逻辑(VML)接口在物理层合并计算和传输,无需中间封装或拆包。在中芯国际0.13µm CMOS中,该架构在1ghz下实现每通道1gbps,为资源受限的边缘设备提供0.625 GOPS。虽然整体能源效率低于纯计算设计,但所提出的结构在面积,栅极密度和可扩展性方面表现出色。这种计算传输架构减少了多芯片系统中的带宽瓶颈和反序列化开销,为未来的神经网络加速器提供了模块化构建块。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A Bit-Serial Compute-Transfer Architecture for High-Speed Data Processing in Chip-to-Chip Systems

A Bit-Serial Compute-Transfer Architecture for High-Speed Data Processing in Chip-to-Chip Systems

This brief proposes a bit-serial compute-transfer architecture tailored for high-speed data processing across chip-to-chip links. Our design merges computation and transmission at the physical layer via a voltage-mode logic (VML) interface, without intermediate packing or unpacking. In SMIC 0.13 µm CMOS, the architecture achieves 1 Gbps per channel at 1 GHz, delivering 0.625 GOPS to resource-constrained edge devices. While overall energy efficiency is lower than that of computing-only designs, the proposed structure excels in area, gate density, and scalability. This compute-transfer architecture reduces bandwidth bottlenecks and deserialization overhead in multi-chip systems, offering a modular building block for future neural network accelerators.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Electronics Letters
Electronics Letters 工程技术-工程:电子与电气
CiteScore
2.70
自引率
0.00%
发文量
268
审稿时长
3.6 months
期刊介绍: Electronics Letters is an internationally renowned peer-reviewed rapid-communication journal that publishes short original research papers every two weeks. Its broad and interdisciplinary scope covers the latest developments in all electronic engineering related fields including communication, biomedical, optical and device technologies. Electronics Letters also provides further insight into some of the latest developments through special features and interviews. Scope As a journal at the forefront of its field, Electronics Letters publishes papers covering all themes of electronic and electrical engineering. The major themes of the journal are listed below. Antennas and Propagation Biomedical and Bioinspired Technologies, Signal Processing and Applications Control Engineering Electromagnetism: Theory, Materials and Devices Electronic Circuits and Systems Image, Video and Vision Processing and Applications Information, Computing and Communications Instrumentation and Measurement Microwave Technology Optical Communications Photonics and Opto-Electronics Power Electronics, Energy and Sustainability Radar, Sonar and Navigation Semiconductor Technology Signal Processing MIMO
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信