{"title":"热沉(HS)-相变材料(PCM)辅助双热管(DHP)用于LED冷却的热性能","authors":"Seyfi Şevik","doi":"10.1016/j.icheatmasstransfer.2025.109304","DOIUrl":null,"url":null,"abstract":"<div><div>This study evaluates the cooling of 30 W high-power light-emitting diodes (LEDs) using a configuration of LED-heat sink (HS), phase change material (PCM), and dual heat pipe (DHP). Furthermore, it aims to recover HS and DHP from abandoned computers, reduce the thermal resistance between the LED junction and the surrounding air, significantly enhance heat dissipation efficiency, and protect luminous flux. Results show that the average thermal resistance (<em>Rth</em>) values for natural convection and forced convection, measured by the PCM-HS-DHP, were 3.50 and 3.22 °C/W, respectively. LED's maximum junction temperature (T<sub>j,max</sub>) is below 113.9 °C and 104.4 °C in natural convection and forced convection, respectively, which meets the requirement of the LED operating below 120 °C. The luminous flux in the forced convection was 3.19 % higher than that in the natural convection, attributed to a lower T<sub>j,max</sub> of 8.34 % due to increased heat transfer. This means extending the LED's lifespan. The enhancement ratio (<em>ER</em>) and reduction ratio (<em>RR</em>) values of 2.54 and 5.54, respectively, showed promising outcomes. Reducing the power of the LED, increasing the air velocity, arranging the DHP to draw heat directly from the entire PCM pool or HS base, and increasing the PCM volume can provide better performance and lower T<sub>j,max</sub>.</div></div>","PeriodicalId":332,"journal":{"name":"International Communications in Heat and Mass Transfer","volume":"167 ","pages":"Article 109304"},"PeriodicalIF":6.4000,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal performance of a heat sink (HS)-phase change material (PCM) assisted dual heat pipe (DHP) for LED cooling\",\"authors\":\"Seyfi Şevik\",\"doi\":\"10.1016/j.icheatmasstransfer.2025.109304\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study evaluates the cooling of 30 W high-power light-emitting diodes (LEDs) using a configuration of LED-heat sink (HS), phase change material (PCM), and dual heat pipe (DHP). Furthermore, it aims to recover HS and DHP from abandoned computers, reduce the thermal resistance between the LED junction and the surrounding air, significantly enhance heat dissipation efficiency, and protect luminous flux. Results show that the average thermal resistance (<em>Rth</em>) values for natural convection and forced convection, measured by the PCM-HS-DHP, were 3.50 and 3.22 °C/W, respectively. LED's maximum junction temperature (T<sub>j,max</sub>) is below 113.9 °C and 104.4 °C in natural convection and forced convection, respectively, which meets the requirement of the LED operating below 120 °C. The luminous flux in the forced convection was 3.19 % higher than that in the natural convection, attributed to a lower T<sub>j,max</sub> of 8.34 % due to increased heat transfer. This means extending the LED's lifespan. The enhancement ratio (<em>ER</em>) and reduction ratio (<em>RR</em>) values of 2.54 and 5.54, respectively, showed promising outcomes. Reducing the power of the LED, increasing the air velocity, arranging the DHP to draw heat directly from the entire PCM pool or HS base, and increasing the PCM volume can provide better performance and lower T<sub>j,max</sub>.</div></div>\",\"PeriodicalId\":332,\"journal\":{\"name\":\"International Communications in Heat and Mass Transfer\",\"volume\":\"167 \",\"pages\":\"Article 109304\"},\"PeriodicalIF\":6.4000,\"publicationDate\":\"2025-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Communications in Heat and Mass Transfer\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0735193325007304\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MECHANICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Communications in Heat and Mass Transfer","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0735193325007304","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MECHANICS","Score":null,"Total":0}
Thermal performance of a heat sink (HS)-phase change material (PCM) assisted dual heat pipe (DHP) for LED cooling
This study evaluates the cooling of 30 W high-power light-emitting diodes (LEDs) using a configuration of LED-heat sink (HS), phase change material (PCM), and dual heat pipe (DHP). Furthermore, it aims to recover HS and DHP from abandoned computers, reduce the thermal resistance between the LED junction and the surrounding air, significantly enhance heat dissipation efficiency, and protect luminous flux. Results show that the average thermal resistance (Rth) values for natural convection and forced convection, measured by the PCM-HS-DHP, were 3.50 and 3.22 °C/W, respectively. LED's maximum junction temperature (Tj,max) is below 113.9 °C and 104.4 °C in natural convection and forced convection, respectively, which meets the requirement of the LED operating below 120 °C. The luminous flux in the forced convection was 3.19 % higher than that in the natural convection, attributed to a lower Tj,max of 8.34 % due to increased heat transfer. This means extending the LED's lifespan. The enhancement ratio (ER) and reduction ratio (RR) values of 2.54 and 5.54, respectively, showed promising outcomes. Reducing the power of the LED, increasing the air velocity, arranging the DHP to draw heat directly from the entire PCM pool or HS base, and increasing the PCM volume can provide better performance and lower Tj,max.
期刊介绍:
International Communications in Heat and Mass Transfer serves as a world forum for the rapid dissemination of new ideas, new measurement techniques, preliminary findings of ongoing investigations, discussions, and criticisms in the field of heat and mass transfer. Two types of manuscript will be considered for publication: communications (short reports of new work or discussions of work which has already been published) and summaries (abstracts of reports, theses or manuscripts which are too long for publication in full). Together with its companion publication, International Journal of Heat and Mass Transfer, with which it shares the same Board of Editors, this journal is read by research workers and engineers throughout the world.