微流控芯片中液滴分裂的主动调节:多物理场耦合模型预测和高通量实验验证

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS
Jianhong Dong , Huimei Lin , Wen Liu , Yuezhu Wang , Junsheng Wang
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引用次数: 0

摘要

液滴的可控分裂在微流体领域中至关重要,在高通量反应、分析和合成中起着至关重要的作用。本研究创新性地构建了基于多级流体控制的微液滴精密分裂系统,实现了对微液滴动态行为的控制。首先进行计算流体动力学(CFD)模拟,全面分析液滴的产生、运移和分裂过程。随后,在微流体系统中进行了一系列实验。我们提出了三种具有渐进式控制功能的芯片设计:基本不调节结构(chip I)、单通道控制结构(chip II)和双通道共调节结构(chip III)。仿真结果与实验数据的显著一致性验证了微液滴分裂的优异可控性。本研究突破了流体动力学聚焦与主动流动控制的结合,建立了微液滴劈裂过程的多参数协同调节机制。此外,它验证了我们新的微流体结构在液滴分裂中的有效性,并为优化各种应用中的高通量过程铺平了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Active regulation of droplet division in microfluidic chips: multi-physics coupled model prediction and high-throughput experimental validation
The controllable splitting of droplets is vital in the field of microfluidics, playing a crucial role in high-throughput reactions, analyses, and syntheses. In this study, we innovatively construct a microdroplet precision splitting system based on multi-level fluid control, and realize the control of droplet dynamic behavior. Initially, computational fluid dynamics (CFD) simulations are carried out to comprehensively analyze the generation, transportation, and splitting processes of droplets. Subsequently, a series of experiments are executed within the microfluidic systems. We proposed three chip designs with progressive control functions: basic unregulated structure (Chip I), single-channel controlled structure (Chip II), and dual-channel co-regulatory structure (Chip III). The remarkable consistency between the simulation results and experimental data validates the exceptional controllability of microdroplet splitting. This study makes a breakthrough in combining fluid dynamics focusing with active flow control, and establishes a multi-parameter collaborative regulation mechanism for the microdroplet splitting process. Additionally, it validates the effectiveness of our new microfluidic structures in droplet splitting and paves the way for optimizing high-throughput processes in various applications.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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