基于磁驱动微楔的跨尺度机械手

IF 4.6 2区 计算机科学 Q2 ROBOTICS
Minghao Yin;Tingting Bao;Xiaozhe You;Wenyue Guo;Jing Cui;Zhongyi Chu
{"title":"基于磁驱动微楔的跨尺度机械手","authors":"Minghao Yin;Tingting Bao;Xiaozhe You;Wenyue Guo;Jing Cui;Zhongyi Chu","doi":"10.1109/LRA.2025.3578239","DOIUrl":null,"url":null,"abstract":"Thedimensions of components have recently expanded in range from the micrometer to centimeter scale in MEMS assembly, necessitating the regulation of adhesion force across a broad range to accommodate cross-scale micromanipulation tasks. Inspired by gecko, anisotropic microwedges can effectively regulate adhesion force by varying the contact area. On this basis, we propose a cross-scale manipulator based on magnetic-driven microwedges. Microwedges embedded with magnetic particles bend along the inclined direction in a unidirectional magnetic field, providing a larger adhesion area to realize pick-up tasks. While the magnetic field is driven in a dual directive mode, the interface between microwedges and the target is progressively disrupted, reducing the adhesion area until the place operation is completed. During the entire process, the actual adhesion area can be detected through microscopic vision to judge whether the pick-and-place conditions are met. Experiments indicate that the ratio of maximum and minimum adhesion force provided by the manipulator can reach 2335.2. The size of silicon wafers which can be put up and placed successfully is from 0.3 × 0.3 × 0.1 mm<inline-formula><tex-math>$^{3}$</tex-math></inline-formula> to 3 × 3 × 0.4 mm<inline-formula><tex-math>$^{3}$</tex-math></inline-formula>, and the volume ratio between them can reach 400. Especially, the proposed manipulator can perform assembly tasks, which shows its stability and capability of cross-scale micromanipulation.","PeriodicalId":13241,"journal":{"name":"IEEE Robotics and Automation Letters","volume":"10 8","pages":"7779-7786"},"PeriodicalIF":4.6000,"publicationDate":"2025-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Cross-Scale Manipulator Based on Magnetic-Driven Microwedges\",\"authors\":\"Minghao Yin;Tingting Bao;Xiaozhe You;Wenyue Guo;Jing Cui;Zhongyi Chu\",\"doi\":\"10.1109/LRA.2025.3578239\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thedimensions of components have recently expanded in range from the micrometer to centimeter scale in MEMS assembly, necessitating the regulation of adhesion force across a broad range to accommodate cross-scale micromanipulation tasks. Inspired by gecko, anisotropic microwedges can effectively regulate adhesion force by varying the contact area. On this basis, we propose a cross-scale manipulator based on magnetic-driven microwedges. Microwedges embedded with magnetic particles bend along the inclined direction in a unidirectional magnetic field, providing a larger adhesion area to realize pick-up tasks. While the magnetic field is driven in a dual directive mode, the interface between microwedges and the target is progressively disrupted, reducing the adhesion area until the place operation is completed. During the entire process, the actual adhesion area can be detected through microscopic vision to judge whether the pick-and-place conditions are met. Experiments indicate that the ratio of maximum and minimum adhesion force provided by the manipulator can reach 2335.2. The size of silicon wafers which can be put up and placed successfully is from 0.3 × 0.3 × 0.1 mm<inline-formula><tex-math>$^{3}$</tex-math></inline-formula> to 3 × 3 × 0.4 mm<inline-formula><tex-math>$^{3}$</tex-math></inline-formula>, and the volume ratio between them can reach 400. Especially, the proposed manipulator can perform assembly tasks, which shows its stability and capability of cross-scale micromanipulation.\",\"PeriodicalId\":13241,\"journal\":{\"name\":\"IEEE Robotics and Automation Letters\",\"volume\":\"10 8\",\"pages\":\"7779-7786\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Robotics and Automation Letters\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11029130/\",\"RegionNum\":2,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ROBOTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Robotics and Automation Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/11029130/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ROBOTICS","Score":null,"Total":0}
引用次数: 0

摘要

最近,MEMS组件的尺寸范围从微米扩展到厘米尺度,需要在广泛的范围内调节附着力,以适应跨尺度的微操作任务。受壁虎的启发,各向异性微楔可以通过改变接触面积来有效调节粘附力。在此基础上,提出了一种基于磁驱动微楔的跨尺度机械手。嵌入磁性颗粒的微楔在单向磁场中沿倾斜方向弯曲,提供更大的粘附面积来实现拾取任务。当磁场以双指令模式驱动时,微楔与目标之间的界面逐渐被破坏,从而减少粘附面积,直到放置操作完成。在整个过程中,可以通过显微视觉检测到实际粘附区域,判断是否满足取放条件。实验表明,该机械手提供的最大与最小粘附力之比可达2335.2。可成功放置的硅片尺寸从0.3 × 0.3 × 0.1 mm$^{3}$到3 × 3 × 0.4 mm$^{3}$,两者的体积比可达400。特别是该机械手能够完成装配任务,显示出其稳定性和跨尺度微操作能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Cross-Scale Manipulator Based on Magnetic-Driven Microwedges
Thedimensions of components have recently expanded in range from the micrometer to centimeter scale in MEMS assembly, necessitating the regulation of adhesion force across a broad range to accommodate cross-scale micromanipulation tasks. Inspired by gecko, anisotropic microwedges can effectively regulate adhesion force by varying the contact area. On this basis, we propose a cross-scale manipulator based on magnetic-driven microwedges. Microwedges embedded with magnetic particles bend along the inclined direction in a unidirectional magnetic field, providing a larger adhesion area to realize pick-up tasks. While the magnetic field is driven in a dual directive mode, the interface between microwedges and the target is progressively disrupted, reducing the adhesion area until the place operation is completed. During the entire process, the actual adhesion area can be detected through microscopic vision to judge whether the pick-and-place conditions are met. Experiments indicate that the ratio of maximum and minimum adhesion force provided by the manipulator can reach 2335.2. The size of silicon wafers which can be put up and placed successfully is from 0.3 × 0.3 × 0.1 mm$^{3}$ to 3 × 3 × 0.4 mm$^{3}$, and the volume ratio between them can reach 400. Especially, the proposed manipulator can perform assembly tasks, which shows its stability and capability of cross-scale micromanipulation.
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来源期刊
IEEE Robotics and Automation Letters
IEEE Robotics and Automation Letters Computer Science-Computer Science Applications
CiteScore
9.60
自引率
15.40%
发文量
1428
期刊介绍: The scope of this journal is to publish peer-reviewed articles that provide a timely and concise account of innovative research ideas and application results, reporting significant theoretical findings and application case studies in areas of robotics and automation.
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