Qiaolong Ji , Yanbin Li , Peihao Ye , Wujing Fu , Guojian Cao , Qihang Han , Xuewen Li , Hao Wu , Guohua Fan
{"title":"界面结构对Ti/Al复合板界面结合强度的影响","authors":"Qiaolong Ji , Yanbin Li , Peihao Ye , Wujing Fu , Guojian Cao , Qihang Han , Xuewen Li , Hao Wu , Guohua Fan","doi":"10.1016/j.pnsc.2025.03.006","DOIUrl":null,"url":null,"abstract":"<div><div>The formation of a thick Al<sub>3</sub>Ti layer at the Ti/Al interface during high-temperature annealing reduces the interfacial bonding strength of Ti/Al clad plates. In this study, the Ti/Al clad plates were fabricated using hot rolling combined with low-temperature diffusion annealing, resulting in the formation of an Al<sub>3</sub>Ti layer with nanoscale thickness. The multiscale structure of the Ti/Al interface was comprehensively investigated. We found that the thickness of Al<sub>3</sub>Ti layer was formed approximately 104 nm after annealing. Compared to the rolled Ti/Al clad plate, the interfacial bonding strength of the annealed Ti/Al clad plate increased from 164.8 MPa to 191.9 MPa. The interfacial structure transferred from an incoherent Ti/Al interface to a combination of coherent Ti/Al<sub>3</sub>Ti and semi-coherent Al/Al<sub>3</sub>Ti interface. Such an interface structure significantly enhanced the interfacial bonding strength. Furthermore, the digital image correlation (DIC) results revealed that the coherent Ti/Al<sub>3</sub>Ti and semi-coherent Al/Al<sub>3</sub>Ti interfaces alleviated localized strain concentration during shear deformation, thereby facilitating the effective strain transfer to the Ti/Al substrate. These findings provide a novel strategy for developing Ti/Al clad plates with superior interfacial bonding strength.</div></div>","PeriodicalId":20742,"journal":{"name":"Progress in Natural Science: Materials International","volume":"35 3","pages":"Pages 568-577"},"PeriodicalIF":7.1000,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The effect of the interface structure on the interfacial bonding strength of Ti/Al clad plates\",\"authors\":\"Qiaolong Ji , Yanbin Li , Peihao Ye , Wujing Fu , Guojian Cao , Qihang Han , Xuewen Li , Hao Wu , Guohua Fan\",\"doi\":\"10.1016/j.pnsc.2025.03.006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The formation of a thick Al<sub>3</sub>Ti layer at the Ti/Al interface during high-temperature annealing reduces the interfacial bonding strength of Ti/Al clad plates. In this study, the Ti/Al clad plates were fabricated using hot rolling combined with low-temperature diffusion annealing, resulting in the formation of an Al<sub>3</sub>Ti layer with nanoscale thickness. The multiscale structure of the Ti/Al interface was comprehensively investigated. We found that the thickness of Al<sub>3</sub>Ti layer was formed approximately 104 nm after annealing. Compared to the rolled Ti/Al clad plate, the interfacial bonding strength of the annealed Ti/Al clad plate increased from 164.8 MPa to 191.9 MPa. The interfacial structure transferred from an incoherent Ti/Al interface to a combination of coherent Ti/Al<sub>3</sub>Ti and semi-coherent Al/Al<sub>3</sub>Ti interface. Such an interface structure significantly enhanced the interfacial bonding strength. Furthermore, the digital image correlation (DIC) results revealed that the coherent Ti/Al<sub>3</sub>Ti and semi-coherent Al/Al<sub>3</sub>Ti interfaces alleviated localized strain concentration during shear deformation, thereby facilitating the effective strain transfer to the Ti/Al substrate. These findings provide a novel strategy for developing Ti/Al clad plates with superior interfacial bonding strength.</div></div>\",\"PeriodicalId\":20742,\"journal\":{\"name\":\"Progress in Natural Science: Materials International\",\"volume\":\"35 3\",\"pages\":\"Pages 568-577\"},\"PeriodicalIF\":7.1000,\"publicationDate\":\"2025-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Progress in Natural Science: Materials International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1002007125000371\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Progress in Natural Science: Materials International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1002007125000371","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
The effect of the interface structure on the interfacial bonding strength of Ti/Al clad plates
The formation of a thick Al3Ti layer at the Ti/Al interface during high-temperature annealing reduces the interfacial bonding strength of Ti/Al clad plates. In this study, the Ti/Al clad plates were fabricated using hot rolling combined with low-temperature diffusion annealing, resulting in the formation of an Al3Ti layer with nanoscale thickness. The multiscale structure of the Ti/Al interface was comprehensively investigated. We found that the thickness of Al3Ti layer was formed approximately 104 nm after annealing. Compared to the rolled Ti/Al clad plate, the interfacial bonding strength of the annealed Ti/Al clad plate increased from 164.8 MPa to 191.9 MPa. The interfacial structure transferred from an incoherent Ti/Al interface to a combination of coherent Ti/Al3Ti and semi-coherent Al/Al3Ti interface. Such an interface structure significantly enhanced the interfacial bonding strength. Furthermore, the digital image correlation (DIC) results revealed that the coherent Ti/Al3Ti and semi-coherent Al/Al3Ti interfaces alleviated localized strain concentration during shear deformation, thereby facilitating the effective strain transfer to the Ti/Al substrate. These findings provide a novel strategy for developing Ti/Al clad plates with superior interfacial bonding strength.
期刊介绍:
Progress in Natural Science: Materials International provides scientists and engineers throughout the world with a central vehicle for the exchange and dissemination of basic theoretical studies and applied research of advanced materials. The emphasis is placed on original research, both analytical and experimental, which is of permanent interest to engineers and scientists, covering all aspects of new materials and technologies, such as, energy and environmental materials; advanced structural materials; advanced transportation materials, functional and electronic materials; nano-scale and amorphous materials; health and biological materials; materials modeling and simulation; materials characterization; and so on. The latest research achievements and innovative papers in basic theoretical studies and applied research of material science will be carefully selected and promptly reported. Thus, the aim of this Journal is to serve the global materials science and technology community with the latest research findings.
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