Peeling of elastic thin films from cylindrical substrates

Peeling thin films from flat substrates is a significant testing method to investigate the behavior and characteristics of interfaces. While curved substrates are also common and widely utilized in engineering applications, the research of film peeling from curved substrates has not yet been fully explored and discussed. To clarify the behavior and characteristics of interfaces in film peeling on curved substrates, new models and test methods of peeling are needed. Herein, we propose a theoretical peeling model to describe the peeling of elastic thin films from cylindrical substrates based on Dugdale’s law and acquire theoretical solutions by moment equilibrium combined with elastica deformation description. These theoretical results can predict the load–displacement (F-Δ) curves and the maximum peeling force (F_max) and match well with finite element method results. We reveal the whole peeling process of thin films along the cylindrical substrates and find that F-Δ curves keep changing due to the substrate radius. A smaller substrate radius yields a more obvious change of peeling force. The substrate radius hardly affects F_max, and an increase in the initial peeling position angle increases F_max. The present study can provide guidance for peeling tests involving curved substrates in practical engineering applications.