ITC对实现通用逻辑门的负偏置HJVTFET影响的研究

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Vikas Ambekar, A. Theja, Meena Panchore, Chithraja Rajan, Bhumika Neole
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引用次数: 0

摘要

本研究的目的是研究界面陷阱电荷(ITC)如何影响p型异质结垂直TFET结构(HJVTFET-WOG和HJVTFET-WG)的逻辑性能。逻辑门可以借助以锗为源材料的HJ-VTFET来实现。利用HJVTFET-WOG和HJVTFET-WG结构,我们的仿真证明了可以实现NAND门和NOR门等双输入通用逻辑功能。通过调整栅极源重叠区域和选择合适的硅体厚度,所提出的垂直TFET能够进行逻辑运算。为了验证通用栅极的功能,考虑捕获电荷的影响,分析了HJVTFET漏极电流特性和能带图。当ITC为正时,逻辑函数的隧道宽度较窄,当ITC为负时,隧道宽度较宽,并对有效亚阈值斜率(SS)进行了检验。已经发现,积极的ITCs可以增强设备的功能,而消极的ITCs会导致功能的减弱。所提出的HJVTFET-WOG结构是在界面陷阱电荷影响下实现数字应用逻辑门的一种有前途的结构,因为它的电学性能比HJVTFET-WG更不容易受到ITC的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of ITC Impact on Negative Bias HJVTFET for Implementing Universal Logic Gates

The objective of this study is to examine how interface trap charges (ITC) influence the logic performance of a p-type heterojunction vertical TFET structure without and with gate overlap (HJVTFET-WOG and HJVTFET-WG). The logic gates can be realized with the help of the HJ-VTFET that uses germanium as the source material. Using HJVTFET-WOG and HJVTFET-WG structures, our simulations have proven that two-input universal logic functions like NAND and NOR gates may be realized. By adjusting the gate-source overlap region and choosing the right silicon body thickness, the suggested vertical TFET is able to perform logic operations. For verifying the universal gate functionality, the HJVTFET drain current characteristic and energy band diagram are analyzed by considering the effect of trapped charges. The tunneling width of logic functions is narrower when the ITC is positive and wider when it is negative, and the effective sub-threshold slopes (SS) have been examined. It has been discovered that positive ITCs can enhance device capabilities, while negative ITCs lead to diminishing functionality. The suggested HJVTFET-WOG structure is a promising structure for implementing the logic gates for digital application under the influence of interface trap charges because its electrical performance is less vulnerable to ITC than HJVTFET-WG.

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来源期刊
CiteScore
4.60
自引率
6.20%
发文量
101
审稿时长
>12 weeks
期刊介绍: Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models. The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics. Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.
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