{"title":"基于增强声发射数据的设备故障诊断:以碳纤维板为例","authors":"Yuxuan Zhang;Rhys Pullin;Bengt Oelmann;Sebastian Bader","doi":"10.1109/TIM.2025.3577849","DOIUrl":null,"url":null,"abstract":"Acoustic emission (AE)-based fault diagnosis in structural health monitoring (SHM) systems faces challenges of data scarcity and model overfitting due to the complexity of AE data acquisition and the high cost of labeling. To address these issues, this study systematically explores various data augmentation techniques for AE signal processing and evaluates their impact on model robustness and accuracy. Furthermore, given the complexity of traditional machine learning (ML) models and their deployment challenges on resource-constrained embedded devices, we investigate lightweight ML algorithms and propose a Tiny ML (TinyML)-based fault diagnosis approach. Experimental validation on a carbon fiber panel fault diagnosis case demonstrates that the proposed method significantly improves classification performance under data-scarce conditions while enabling real-time fault diagnosis on embedded systems. These findings underscore the potential of integrating data augmentation, lightweight ML algorithms, and TinyML to enhance both diagnostic accuracy and real-time performance in SHM applications.","PeriodicalId":13341,"journal":{"name":"IEEE Transactions on Instrumentation and Measurement","volume":"74 ","pages":"1-12"},"PeriodicalIF":5.6000,"publicationDate":"2025-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On-Device Fault Diagnosis With Augmented Acoustic Emission Data: A Case Study on Carbon Fiber Panels\",\"authors\":\"Yuxuan Zhang;Rhys Pullin;Bengt Oelmann;Sebastian Bader\",\"doi\":\"10.1109/TIM.2025.3577849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Acoustic emission (AE)-based fault diagnosis in structural health monitoring (SHM) systems faces challenges of data scarcity and model overfitting due to the complexity of AE data acquisition and the high cost of labeling. To address these issues, this study systematically explores various data augmentation techniques for AE signal processing and evaluates their impact on model robustness and accuracy. Furthermore, given the complexity of traditional machine learning (ML) models and their deployment challenges on resource-constrained embedded devices, we investigate lightweight ML algorithms and propose a Tiny ML (TinyML)-based fault diagnosis approach. Experimental validation on a carbon fiber panel fault diagnosis case demonstrates that the proposed method significantly improves classification performance under data-scarce conditions while enabling real-time fault diagnosis on embedded systems. These findings underscore the potential of integrating data augmentation, lightweight ML algorithms, and TinyML to enhance both diagnostic accuracy and real-time performance in SHM applications.\",\"PeriodicalId\":13341,\"journal\":{\"name\":\"IEEE Transactions on Instrumentation and Measurement\",\"volume\":\"74 \",\"pages\":\"1-12\"},\"PeriodicalIF\":5.6000,\"publicationDate\":\"2025-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Instrumentation and Measurement\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11029626/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Instrumentation and Measurement","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11029626/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
On-Device Fault Diagnosis With Augmented Acoustic Emission Data: A Case Study on Carbon Fiber Panels
Acoustic emission (AE)-based fault diagnosis in structural health monitoring (SHM) systems faces challenges of data scarcity and model overfitting due to the complexity of AE data acquisition and the high cost of labeling. To address these issues, this study systematically explores various data augmentation techniques for AE signal processing and evaluates their impact on model robustness and accuracy. Furthermore, given the complexity of traditional machine learning (ML) models and their deployment challenges on resource-constrained embedded devices, we investigate lightweight ML algorithms and propose a Tiny ML (TinyML)-based fault diagnosis approach. Experimental validation on a carbon fiber panel fault diagnosis case demonstrates that the proposed method significantly improves classification performance under data-scarce conditions while enabling real-time fault diagnosis on embedded systems. These findings underscore the potential of integrating data augmentation, lightweight ML algorithms, and TinyML to enhance both diagnostic accuracy and real-time performance in SHM applications.
期刊介绍:
Papers are sought that address innovative solutions to the development and use of electrical and electronic instruments and equipment to measure, monitor and/or record physical phenomena for the purpose of advancing measurement science, methods, functionality and applications. The scope of these papers may encompass: (1) theory, methodology, and practice of measurement; (2) design, development and evaluation of instrumentation and measurement systems and components used in generating, acquiring, conditioning and processing signals; (3) analysis, representation, display, and preservation of the information obtained from a set of measurements; and (4) scientific and technical support to establishment and maintenance of technical standards in the field of Instrumentation and Measurement.