Intrinsic triazoimide membrane with highly efficient thermal management performance base on hydrogen bondings and π-π stacking of triazole rings

With the miniaturization of electronic devices, higher requirements have been put forward for the performance of heat dissipation films to overcome the problem of large heat accumulation in a short time. The triazole group is introduced into the diamine monomer via clicking chemistry, and the mechanical properties of the material can be modulated by molecular design, endowing the film material with higher thermal stability and mechanical properties. Simultaneously, it is found that the films exhibit excellent thermal conductivity, which is 3.4 times greater than that of pure polyimide. Notably, extreme environments do not affect the heat dissipation ability of the film, which benefits from the strong dipole interaction and π-π stacking synergy. The contradiction between high thermal conductivity, high and low temperature resistance, and excellent mechanical properties has been broken, providing a feasible solution for the development of intrinsic thermal conductive polymers in extreme environments.