{"title":"面向6G的XR应用的150ghz频段紧凑型相控阵AiP模块","authors":"Yohei Morishita;Ken Takahashi;Ryosuke Hasaba;Akihiro Egami;Tomoki Abe;Masatoshi Suzuki;Tomohiro Murata;Yoichi Nakagawa;Yudai Yamazaki;Sunghwan Park;Takaya Uchino;Chenxin Liu;Jun Sakamaki;Takashi Tomura;Hiroyuki Sakai;Hiroshi Taneda;Kei Murayama;Yoko Nakabayashi;Shinsuke Hara;Issei Watanabe;Akifumi Kasamatsu;Kenichi Okada;Koji Takinami","doi":"10.1109/LMWT.2025.3565729","DOIUrl":null,"url":null,"abstract":"To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of <inline-formula> <tex-math>$8.42\\times 20.0\\times 1.37$ </tex-math></inline-formula> mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.","PeriodicalId":73297,"journal":{"name":"IEEE microwave and wireless technology letters","volume":"35 6","pages":"920-923"},"PeriodicalIF":3.4000,"publicationDate":"2025-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11023526","citationCount":"0","resultStr":"{\"title\":\"150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G\",\"authors\":\"Yohei Morishita;Ken Takahashi;Ryosuke Hasaba;Akihiro Egami;Tomoki Abe;Masatoshi Suzuki;Tomohiro Murata;Yoichi Nakagawa;Yudai Yamazaki;Sunghwan Park;Takaya Uchino;Chenxin Liu;Jun Sakamaki;Takashi Tomura;Hiroyuki Sakai;Hiroshi Taneda;Kei Murayama;Yoko Nakabayashi;Shinsuke Hara;Issei Watanabe;Akifumi Kasamatsu;Kenichi Okada;Koji Takinami\",\"doi\":\"10.1109/LMWT.2025.3565729\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of <inline-formula> <tex-math>$8.42\\\\times 20.0\\\\times 1.37$ </tex-math></inline-formula> mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.\",\"PeriodicalId\":73297,\"journal\":{\"name\":\"IEEE microwave and wireless technology letters\",\"volume\":\"35 6\",\"pages\":\"920-923\"},\"PeriodicalIF\":3.4000,\"publicationDate\":\"2025-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11023526\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE microwave and wireless technology letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11023526/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"0\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE microwave and wireless technology letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/11023526/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"0","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of $8.42\times 20.0\times 1.37$ mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.
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