Liguang Dong , Zhenyu Zhang , Feng Zhao , Qiyuan Li , Hongxiu Zhou , Xiaofei Yang , Xiuqing Liu , Junde Guo , Xuan Zheng
{"title":"新型绿色化学机械抛光制备的镍合金原子表面","authors":"Liguang Dong , Zhenyu Zhang , Feng Zhao , Qiyuan Li , Hongxiu Zhou , Xiaofei Yang , Xiuqing Liu , Junde Guo , Xuan Zheng","doi":"10.1016/j.triboint.2025.110902","DOIUrl":null,"url":null,"abstract":"<div><div>It poses a challenge to garner surface roughness less than 0.5 nm using a green polishing for a Ni alloy. To solve this challenge, a novel green chemical mechanical polishing (CMP) was developed, containing silica, citric acid and hydrogen peroxide. After CMP, surface roughness of 0.215 nm was achieved on a Ni alloy of GH3536 at a measurement area of 50 × 50 μm<sup>2</sup>, and the material removal rate (MRR) is 43.8 nm/min. Polishing mechanism is elucidated by nanoscratching through molecular dynamics (MD) simulations. MD simulations reveal that rolling of abrasives between the Ni alloy and polishing pad dominates the polishing process. Densification of silica abrasives during rolling could alleviate the compressive stress compared with that in nanoscratching.'</div></div>","PeriodicalId":23238,"journal":{"name":"Tribology International","volume":"211 ","pages":"Article 110902"},"PeriodicalIF":6.1000,"publicationDate":"2025-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Atomic surface on a Ni alloy produced by novel green chemical mechanical polishing\",\"authors\":\"Liguang Dong , Zhenyu Zhang , Feng Zhao , Qiyuan Li , Hongxiu Zhou , Xiaofei Yang , Xiuqing Liu , Junde Guo , Xuan Zheng\",\"doi\":\"10.1016/j.triboint.2025.110902\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>It poses a challenge to garner surface roughness less than 0.5 nm using a green polishing for a Ni alloy. To solve this challenge, a novel green chemical mechanical polishing (CMP) was developed, containing silica, citric acid and hydrogen peroxide. After CMP, surface roughness of 0.215 nm was achieved on a Ni alloy of GH3536 at a measurement area of 50 × 50 μm<sup>2</sup>, and the material removal rate (MRR) is 43.8 nm/min. Polishing mechanism is elucidated by nanoscratching through molecular dynamics (MD) simulations. MD simulations reveal that rolling of abrasives between the Ni alloy and polishing pad dominates the polishing process. Densification of silica abrasives during rolling could alleviate the compressive stress compared with that in nanoscratching.'</div></div>\",\"PeriodicalId\":23238,\"journal\":{\"name\":\"Tribology International\",\"volume\":\"211 \",\"pages\":\"Article 110902\"},\"PeriodicalIF\":6.1000,\"publicationDate\":\"2025-06-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Tribology International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0301679X25003974\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tribology International","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0301679X25003974","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Atomic surface on a Ni alloy produced by novel green chemical mechanical polishing
It poses a challenge to garner surface roughness less than 0.5 nm using a green polishing for a Ni alloy. To solve this challenge, a novel green chemical mechanical polishing (CMP) was developed, containing silica, citric acid and hydrogen peroxide. After CMP, surface roughness of 0.215 nm was achieved on a Ni alloy of GH3536 at a measurement area of 50 × 50 μm2, and the material removal rate (MRR) is 43.8 nm/min. Polishing mechanism is elucidated by nanoscratching through molecular dynamics (MD) simulations. MD simulations reveal that rolling of abrasives between the Ni alloy and polishing pad dominates the polishing process. Densification of silica abrasives during rolling could alleviate the compressive stress compared with that in nanoscratching.'
期刊介绍:
Tribology is the science of rubbing surfaces and contributes to every facet of our everyday life, from live cell friction to engine lubrication and seismology. As such tribology is truly multidisciplinary and this extraordinary breadth of scientific interest is reflected in the scope of Tribology International.
Tribology International seeks to publish original research papers of the highest scientific quality to provide an archival resource for scientists from all backgrounds. Written contributions are invited reporting experimental and modelling studies both in established areas of tribology and emerging fields. Scientific topics include the physics or chemistry of tribo-surfaces, bio-tribology, surface engineering and materials, contact mechanics, nano-tribology, lubricants and hydrodynamic lubrication.