热-机械耦合梯度增强损伤建模的新方法

IF 2.7 3区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
Fangrui Liu, Dustin Roman Jantos, Philipp Junker
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引用次数: 0

摘要

热机械损伤,如热冲击,是一个常见的工程问题。损伤与温度的反向相互作用构成了一个具有挑战性的问题:材料损伤导致能量耗散导致温度升高;温度也影响损伤的演变。一方面,温度的升高降低了损伤阈值,使损伤更容易发生。另一方面,温度分布不均匀会在材料内部产生内应力,从而导致损伤的发生。考虑到上述所有问题,我们提出了一种基于Hamilton原理的热-机械耦合梯度增强损伤建模新方法。为了加快计算速度,我们采用邻元法计算损伤变量和温度控制方程中的拉普拉斯算子。数值算例表明了该方法的鲁棒性和有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Approach to Thermo-Mechanically Coupled, Gradient-Enhanced Damage Modeling

Thermo-mechanical damage, such as thermal shock, is a common engineering problem. It constitutes a challenging problem that damage and temperature are conversely interacting with each other: Material damage leads to an increase in temperature due to energy dissipation; temperature also influences damage evolution. On the one hand, an increase in temperature decreases the damage threshold, which makes damage more likely to occur. On the other hand, a non-uniform temperature distribution can cause internal stresses within the material, leading to the occurrence of damage. Taking all of the above points into account, we introduce a novel approach based on the Hamilton principle for thermo-mechanically coupled, gradient-enhanced damage modeling. To accelerate the computation speed, we adopt the Neighbored Element Method to calculate the Laplace operator in the governing equation of both the damage variable and temperature. The numerical examples show the robustness and efficiency of our method.

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来源期刊
CiteScore
5.70
自引率
6.90%
发文量
276
审稿时长
5.3 months
期刊介绍: The International Journal for Numerical Methods in Engineering publishes original papers describing significant, novel developments in numerical methods that are applicable to engineering problems. The Journal is known for welcoming contributions in a wide range of areas in computational engineering, including computational issues in model reduction, uncertainty quantification, verification and validation, inverse analysis and stochastic methods, optimisation, element technology, solution techniques and parallel computing, damage and fracture, mechanics at micro and nano-scales, low-speed fluid dynamics, fluid-structure interaction, electromagnetics, coupled diffusion phenomena, and error estimation and mesh generation. It is emphasized that this is by no means an exhaustive list, and particularly papers on multi-scale, multi-physics or multi-disciplinary problems, and on new, emerging topics are welcome.
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