“用于增材制造的二维纳米硅酸盐：流变改性剂、牺牲油墨和支撑浴生物打印”的勘误表[Bioprinting 25 (2022) e00187]

{"title":"“用于增材制造的二维纳米硅酸盐：流变改性剂、牺牲油墨和支撑浴生物打印”的勘误表[Bioprinting 25 (2022) e00187]","authors":"Satyam Rajput , Kaivalya A. Deo , Tanmay Mathur , Giriraj Lokhande , Kanwar Abhay Singh , Yuxiang Sun , Daniel L. Alge , Abhishek Jain , Tapasree Roy Sarkar , Akhilesh K. Gaharwar","doi":"10.1016/j.bprint.2025.e00417","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":37770,"journal":{"name":"Bioprinting","volume":"49 ","pages":"Article e00417"},"PeriodicalIF":0.0000,"publicationDate":"2025-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Corrigendum to “2D Nanosilicate for additive manufacturing: Rheological modifier, sacrificial ink and support bath Bioprinting” [Bioprinting 25 (2022) e00187]\",\"authors\":\"Satyam Rajput , Kaivalya A. Deo , Tanmay Mathur , Giriraj Lokhande , Kanwar Abhay Singh , Yuxiang Sun , Daniel L. Alge , Abhishek Jain , Tapasree Roy Sarkar , Akhilesh K. Gaharwar\",\"doi\":\"10.1016/j.bprint.2025.e00417\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":37770,\"journal\":{\"name\":\"Bioprinting\",\"volume\":\"49 \",\"pages\":\"Article e00417\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-04-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Bioprinting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2405886625000338\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"Computer Science\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bioprinting","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2405886625000338","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"Computer Science","Score":null,"Total":0}