基于结构约束和伪监督的无监督域自适应集成电路图像分割

IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Deruo Cheng, Yee-Yang Tee, Xuenong Hong, Tong Lin, Yiqiong Shi, Bah-Hwee Gwee
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引用次数: 0

摘要

集成电路图像分割对于全球化供应链中集成电路的功能验证和可靠性评估至关重要。传统的有监督深度学习模型在应用于IC图像分割时,面临着显著的领域转移挑战。为了解决这个问题,我们提出了一个具有结构约束和伪监督(SCPS)的领域自适应框架,以提高从不同IC层收集的目标数据集的分割性能。我们提出的SCPS首先利用CycleGAN与源数据集的输入掩模合成目标数据集,其中对合成目标图像和源掩模中的电路元件的结构模式施加约束,以提高其结构一致性。它进一步利用未标记的真实目标图像,通过域混合和图像/特征级增强与训练期间的伪监督。通过对从两个不同IC芯片层收集的目标数据集的实验,我们提出的SCPS在从IC图像分割中检索电路连接的准确性方面优于现有方法,同时在常用分割指标方面保持相当的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Unsupervised domain adaptation for IC image segmentation with structural constraint and pseudo supervision

Unsupervised domain adaptation for IC image segmentation with structural constraint and pseudo supervision
Integrated circuit (IC) image segmentation is crucial for functional verification and trustworthiness evaluation of ICs manufactured in the globalized supply chain. Conventional supervised deep learning models for IC image segmentation face significant challenges of domain shift when applied across IC layers. To address this, we propose a domain adaptation framework with Structural Constraint and Pseudo Supervision (SCPS) for improving segmentation performance on target datasets collected from different IC layers. Our proposed SCPS first leverages CycleGAN to synthesize target dataset with input masks from source dataset, where a constraint is imposed onto the structural patterns of circuit elements in synthetic target images and source masks to improve their structural consistency. It further utilizes unlabeled real target images through domain mixing and image−/feature-level augmentation with pseudo supervision during training. With experiments on target datasets collected from two different IC chip layers, our proposed SCPS outperforms existing methods in the accuracy of circuit connections retrieved from IC image segmentation, while maintaining comparable performance in terms of commonly used segmentation metrics.
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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