ME20镁合金晶间变形行为的原位观察

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yurui Sang , Meilong Feng , Weiming Zhang , Liangshun Huang
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引用次数: 0

摘要

晶间变形行为对镁合金塑性的提高起着至关重要的作用。本研究通过原位拉伸试验结合EBSD分析,阐明了高延性ME20合金的晶间变形机理。数字图像相关(DIC)分析显示,细粒区域的变形均匀性增强,而混合晶粒区域由于背应力积累而在三联结处发生应变局部化。特殊取向孪晶界限制了粗晶中的应变调节。变形后期的三维应变调节是通过锥体II <;c+a>;基础<; >;滑动。值得注意的是,高几何相容系数(m’)值的边界有利于滑移传播,但矛盾的是,它是首选的微裂纹成核点。这一机理揭示了晶间变形是ME20合金塑性增强的控制因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
In situ observation of the intergranular deformation behaviour of ME20 magnesium alloy
Intergranular deformation behavior plays a pivotal role in enhancing magnesium alloy ductility. This study elucidates intergranular deformation mechanisms in high-ductility ME20 alloy through in situ tensile testing combined with EBSD analysis. Digital image correlation (DIC) analysis reveals enhanced deformation homogeneity in fine-grained regions, while mixed-grain zones develop strain localization at triple junctions due to back stress accumulation. Special-orientation twin boundaries restrict strain accommodation in coarse grains. Three-dimensional strain accommodation during later deformation stages is achieved through coordinated activation of pyramidal II <c+a> and basal <a> slip. Notably, high geometric compatibility factor (m') value boundaries enable slip transmission yet paradoxically act as preferred microcrack nucleation sites. This mechanistic revelation establishes intergranular deformation as the governing factor for ME20 alloy’s enhanced ductility.
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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