一种新型电子束增材制造方法:基于扩散的预熔电子束自由成形技术

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Xi Shu , Guoqing Chen , Chunyu Wang , Chunju Wang , Lining Sun
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引用次数: 0

摘要

增材制造仍然面临着一些重大挑战,包括晶粒结构粗糙、元件分布不均匀、过程控制困难等。本研究针对这些问题,提出了预熔电子束自由曲面制造方法。钨导流喷嘴用于减轻过多的热输入和激烈的熔池搅拌。该喷嘴减少了电子束对母材的直接冲击,促进了制造零件的晶粒细化,提高了其机械性能。熔化的金属只是湿润并扩散在母材的表面,避免了母材更深的熔化。当10层镀层达到最佳层间熔合时,其抗拉强度可达1083 MPa,与锻造后的TC4钛合金相当。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel electron beam additive manufacturing method: diffusion-based pre-melted electron beam freeform fabrication
Additive manufacturing still faces several significant challenges, including coarse grain structure, uneven element distribution, and difficulties in process control. This study introduces the pre-melted electron beam freeform fabrication method as a targeted solution to these issues. A tungsten diversion nozzle is employed to mitigate excessive thermal input and intense melt pool stirring. This nozzle reduces direct electron beam impact on the base metal, promoting grain refinement within the fabricated part and enhancing its mechanical properties. The molten metal merely wets and spreads on the surface of the base metal, avoiding deeper base metal melting. When the 10-layer deposit achieves optimal interlayer fusion, it exhibits a tensile strength of up to 1083 MPa, comparable to that of forged TC4 titanium alloy.
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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