用于神经形态计算的亚量子半金属铋和氧空位灯丝忆阻器

IF 8.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Chenyu Zhuge, Jiandong Jiang, Liang Chen, Zhichao Xie, Guangyue Shen, Yujun Fu, Qi Wang* and Deyan He, 
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引用次数: 0

摘要

记忆电阻器作为神经突触器件,由于其高可扩展性而被认为是非冯·诺伊曼结构的优秀候选者。然而,最先进的丝状忆阻器的丝的随机性导致高可变性和可靠性差。本文提出了一种具有氧空位(VO) -Bi丝的半金属铋基忆阻器。基于铋的忆阻器具有亚量子电导变化、高开关一致性和可控制的权重更新线性度。通过球面像差校正扫描透射电子显微镜(AC-STEM)和密度泛函理论(DFT)计算,阐明了VO和Bi团簇在细丝中的形成机理以及VO - Bi细丝的整体开关机制。具体来说,VO在Bi离子迁移时提供了导电路径,导致SiO2层中Bi簇的减少。此外,基于反向传播系统和储层计算系统的人工神经网络(ANN)模拟的数字识别准确率分别达到95.77%和94.15%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Subquantum Semimetal Bi and Oxygen Vacancy Filament Memristors for Neuromorphic Computing

Subquantum Semimetal Bi and Oxygen Vacancy Filament Memristors for Neuromorphic Computing

Memristors, as neural synapse devices, have been regarded as excellent candidates for non-von Neumann architecture because of their high scalability. However, the randomness of the filaments of state-of-the-art filamentary memristors leads to high variability and poor reliability. Herein, a semimetal bismuth (Bi)-based memristor with oxygen vacancy (VO)–Bi filaments was proposed. The Bi-based memristor has a subquantum conductance change, high switching consistency, and controllable weight update linearity. Through spherical aberration-corrected scanning transmission electron microscopy (AC-STEM) and density functional theory (DFT) calculations, the formation mechanism of VO and Bi clusters in the filaments and the overall switching mechanism of the VO–Bi filaments were elucidated. Specifically, VO provides a conductive path while Bi ions migrate, leading to the reduction of Bi clusters in the SiO2 layer. Furthermore, artificial neural network (ANN) simulations based on back-propagation and reservoir computing (RC) systems achieved large digit recognition accuracies of 95.77 and 94.15%, respectively.

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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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