一类准脆性结合材料界面裂纹的解析解

IF 3.2 2区 材料科学 Q2 ENGINEERING, MECHANICAL
A. A. Kaminsky, M. V. Dudyk, Y. O. Chornoivan
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引用次数: 0

摘要

给出了裂纹尖端附近存在小尺度过程区的准脆性结合材料界面裂纹问题的解析解。在过程区,假定为Mises-Hill型的二次强度准则。将计算工艺区参数的问题简化为一个矢量泛函方程,并利用维纳-霍普夫方法得到了精确的解析解。根据所得到的解,导出了一个封闭的超越方程组,用于确定过程区长度、载荷相位角和区域内的能量释放率,形成了一个可访问的算法,用于估计裂纹沿界面扩展之前的极限载荷。对所建立的模型进行了数值分析,并论证了该模型在某些复合材料断裂研究中的应用可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Analytical Solution for the Interface Crack in a Quasi-Brittle Bonding Material

An analytical solution to the problem of an interface crack in the presence of a small-scale process zone in a quasi-brittle bonding material near the crack tip is presented. In the process zone, a quadratic strength criterion of the Mises–Hill type is assumed. The problem of calculating the parameters of the process zone is reduced to a vector functional equation, for which a precise analytical solution can be found using the Wiener–Hopf method. From the solution found, a closed system of transcendental equations is derived for determining the length of the process zone, the phase angle of the load, and the energy release rate in the zone, which form an accessible algorithm for estimating the limit loads that precede propagation of the crack along the interface. Numerical analysis of the developed model is performed, and the possibility of its application in fracture studies of some composite materials is demonstrated.

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来源期刊
CiteScore
6.30
自引率
18.90%
发文量
256
审稿时长
4 months
期刊介绍: Fatigue & Fracture of Engineering Materials & Structures (FFEMS) encompasses the broad topic of structural integrity which is founded on the mechanics of fatigue and fracture, and is concerned with the reliability and effectiveness of various materials and structural components of any scale or geometry. The editors publish original contributions that will stimulate the intellectual innovation that generates elegant, effective and economic engineering designs. The journal is interdisciplinary and includes papers from scientists and engineers in the fields of materials science, mechanics, physics, chemistry, etc.
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